Next Article in Journal
Switching VO2 Single Crystals and Related Phenomena: Sliding Domains and Crack Formation
Previous Article in Journal
On the Morphology of the SDS Film on the Surface of Borosilicate Glass
Open AccessArticle

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Institute of Mechanical Engineering, Zhengzhou 450001, China
Author to whom correspondence should be addressed.
Materials 2017, 10(5), 558;
Received: 3 March 2017 / Revised: 16 May 2017 / Accepted: 17 May 2017 / Published: 19 May 2017
With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate. View Full-Text
Keywords: Sn-58Bi solder; lead-free solder; microstructure Sn-58Bi solder; lead-free solder; microstructure
Show Figures

Figure 1

MDPI and ACS Style

Yang, F.; Zhang, L.; Liu, Z.-Q.; Zhong, S.J.; Ma, J.; Bao, L. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder. Materials 2017, 10, 558.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

Back to TopTop