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Appl. Sci. 2018, 8(11), 2024; https://doi.org/10.3390/app8112024

Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
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Received: 19 September 2018 / Revised: 13 October 2018 / Accepted: 16 October 2018 / Published: 23 October 2018
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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Abstract

Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost. Compared with Sn-Bi solder alloy and Sn-Pb solder alloy, the strength and plasticity of Sn-Bi solder are not enough, due to the higher brittleness of bismuth, which thus limits the application of Sn-Bi solder. In order to improve the properties of Sn-Bi solder, a novel solder paste strengthened with resin was developed by mixing epoxy resin (ER) with Sn-58Bi solder, which enhanced the joint strength at a low cost. Aimed at the electronic industry, in this study, the spreadability of the novel solder paste was investigated, and the mechanical properties and microstructure of solder joints after reflow soldering were tested and analyzed. The results showed that when the content of epoxy resin was in the optimum range, the shear strength was significantly higher, reaching nearly twice that of Sn-58Bi solder alone. View Full-Text
Keywords: Sn-58Bi solder paste; epoxy resin; wettability; shear strength; microstructure Sn-58Bi solder paste; epoxy resin; wettability; shear strength; microstructure
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Liu, L.; Xue, S.; Liu, S. Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin. Appl. Sci. 2018, 8, 2024.

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