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Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Department of Materials Science and Engineering, University of Seoul, 163, Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea
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Academic Editor: Jan Vrestal
Metals 2021, 11(2), 364; https://doi.org/10.3390/met11020364
Received: 20 January 2021 / Revised: 8 February 2021 / Accepted: 17 February 2021 / Published: 22 February 2021
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. View Full-Text
Keywords: low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechanical property low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechanical property
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MDPI and ACS Style

Kang, H.; Rajendran, S.H.; Jung, J.P. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics. Metals 2021, 11, 364. https://doi.org/10.3390/met11020364

AMA Style

Kang H, Rajendran SH, Jung JP. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics. Metals. 2021; 11(2):364. https://doi.org/10.3390/met11020364

Chicago/Turabian Style

Kang, Hyejun, Sri Harini Rajendran, and Jae P. Jung 2021. "Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics" Metals 11, no. 2: 364. https://doi.org/10.3390/met11020364

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