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Volume 8
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10.3390/met8010042
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Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

by
Shuye Zhang
1,*,
Ming Yang
2,
Mingliang Jin
3,4,
Wen-Can Huang
3,
Tiesong Lin
1,
Peng He
1,
Panpan Lin
1 and
Kyung-Wook Paik
5
1
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
2
Yik Shing Tat Industrial Co., Ltd., Shenzhen 518101, China
3
Department of Chemical and Biomolecular Engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 305-338, Korea
4
Department of Nano-Structured Materials Research, National NanoFab Center (NNFC), 291 Daehak-ro, Yuseong-gu, Daejeon 305-338, Korea
5
Department of Materials Science and Engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 305-338, Korea
*
Author to whom correspondence should be addressed.
Metals 2018, 8(1), 42; https://doi.org/10.3390/met8010042
Received: 11 December 2017 / Revised: 2 January 2018 / Accepted: 3 January 2018 / Published: 9 January 2018
(This article belongs to the Special Issue Science, Characterization and Technology of Joining and Welding)
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Abstract

Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test. View Full-Text
Keywords: adhesive thermos-mechanical property; SnBi58 solder joint morphology; flex-on-board assembly; thermal compression bonding; ultrasonic bonding adhesive thermos-mechanical property; SnBi58 solder joint morphology; flex-on-board assembly; thermal compression bonding; ultrasonic bonding
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
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MDPI and ACS Style

Zhang, S.; Yang, M.; Jin, M.; Huang, W.-C.; Lin, T.; He, P.; Lin, P.; Paik, K.-W. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers. Metals 2018, 8, 42. https://doi.org/10.3390/met8010042

AMA Style

Zhang S, Yang M, Jin M, Huang W-C, Lin T, He P, Lin P, Paik K-W. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers. Metals. 2018; 8(1):42. https://doi.org/10.3390/met8010042

Chicago/Turabian Style

Zhang, Shuye; Yang, Ming; Jin, Mingliang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; Paik, Kyung-Wook. 2018. "Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers" Metals 8, no. 1: 42. https://doi.org/10.3390/met8010042

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