Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers
Zhang, S.; Yang, M.; Jin, M.; Huang, W.-C.; Lin, T.; He, P.; Lin, P.; Paik, K.-W. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers. Metals 2018, 8, 42. https://doi.org/10.3390/met8010042
Zhang S, Yang M, Jin M, Huang W-C, Lin T, He P, Lin P, Paik K-W. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers. Metals. 2018; 8(1):42. https://doi.org/10.3390/met8010042
Chicago/Turabian StyleZhang, Shuye, Ming Yang, Mingliang Jin, Wen-Can Huang, Tiesong Lin, Peng He, Panpan Lin, and Kyung-Wook Paik. 2018. "Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers" Metals 8, no. 1: 42. https://doi.org/10.3390/met8010042