Micromachines

Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process. The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue policies and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.

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MEMS Inertial Device, 3rd Edition

edited by

Huiliang Cao

submission deadline 20 Jun 2026 | Viewed by 26 | Submission Open

Keywords: MEMS inertial device; MEMS inertial device controlling method; inertial device signal processing; MEMS inertial device modeling and simulation; MEMS gyroscope; MEMS accelerometer

(This special issue belongs to the Section A：Physics)

Preparation, Manipulation, and Biomedical Applications of Micro/Nanodroplets/Fluids

edited by Xing Han and

Jiaqian Li

submission deadline 30 Jun 2026 | 1 articles | Viewed by 589 | Submission Open

Keywords: droplets; microfluidics; biomedical applications; droplet preparation; micro/nanoscale

(This special issue belongs to the Section B：Biology and Biomedicine)

GaN-Based Materials and Devices: Research and Applications, 2nd Edition

edited by Wei Liu and Kun Wang

submission deadline 30 Jun 2026 | 1 articles | Viewed by 574 | Submission Open

Keywords: group III-nitrides semiconductors; epitaxial growth and fabrication; Al(In)GaN heterostructure; polarization and piezoelectric effect; nanostructures for wide bandgap materials; RF and power devices; display and illumination applications; novel design concepts; device simulation

(This special issue belongs to the Section D1: Semiconductor Devices)

Nanoparticles in Tissue Engineering and Regenerative Medicine

edited by

Dong Kee Yi

Sitansu Sekhar Nanda

and

Seong Soo A. An

submission deadline 30 Jun 2026 | Viewed by 201 | Submission Open

Keywords: nanoparticle; TERM; scaffold; bone diseases; biomaterials

(This special issue belongs to the Section B3: Nanoparticles in Biomedicine)

Electrokinetic Principles in Biological and Biomedical Systems

edited by Gongchen (GC) Sun

submission deadline 30 Jun 2026 | Viewed by 99 | Submission Open

Keywords: electrokinetics; micro/nanofluidics; electrophoresis; dielectrophoresis; electroosmosis; ion concentration polarization; charge separation; membrane potential; electrotaxis; cell signaling

(This special issue belongs to the Section C1: Micro/Nanoscale Electrokinetics)

AI-Driven Biofabrication: Accelerating Design, Optimization, and Translation

edited by

Miriam Filippi

submission deadline 30 Jun 2026 | Viewed by 83 | Submission Open

Keywords: biofabrication; machine learning; artificial intelligence; predictive modeling; high-throughput experimentation; simulation-based design; process optimization; scalability; sustainable engineering; material design; cell behavior prediction

(This special issue belongs to the Section B2: Biofabrication and Tissue Engineering)

Microfluidics-Based Drug Screening and Delivery Technology

edited by

Ciprian Iliescu

and

Florina Silvia Iliescu

submission deadline 30 Jun 2026 | Viewed by 70 | Submission Open

Keywords: microfluidics; micro and nanotechnology; drug delivery; drug screening; drug carriers; microphysiological systems; transdermal drug delivery; microneedles; personalized medicine

(This special issue belongs to the Section B：Biology and Biomedicine)

Power Semiconductor Devices and Integration Technology

edited by Jie Wei

submission deadline 30 Jun 2026 | Viewed by 66 | Submission Open

Keywords: high voltage devices; low voltage devices; power IC device technology; power IC design; wide bandgap semiconductor (GaN; SiC; GaO; and so on)

(This special issue belongs to the Section D1: Semiconductor Devices)

Additively Manufactured Microchannels: Microfluidics and Microscale Thermal Management

edited by

Pamela Vocale

submission deadline 30 Jun 2026 | Viewed by 58 | Submission Open

Keywords: additive manufacturing; microchannel geometry optimization; innovative microchannel geometries; microscale thermal management; heat transfer enhancement; microfluidics

(This special issue belongs to the Section A：Physics)

Next-Generation Biomedical Devices

edited by Kyowon Kang and

Hee-Jae Jeon

submission deadline 30 Jun 2026 | Viewed by 38 | Submission Open

Keywords: wearable devices; implantable devices; neuromorphic devices; organ-on-chip; biosensors; wireless communication; energy harvesting; low-power biomedical devices; bioelectronic integrated circuits; physiological sensing; physiological stimulation

(This special issue belongs to the Section B：Biology and Biomedicine)

Recent Progress in Biosensors for Clinical Diagnostics, Food Quality Control, and Environmental Monitoring

edited by

Viktoriya Pyeshkova

submission deadline 30 Jun 2026 | Viewed by 19 | Submission Open

Keywords: electrochemical biosensors; nanostructured materials; biosensor systems; point-of-care diagnostics; wearable and implantable biosensors; microfluidics and lab-on-chip devices; machine learning in biosensing; biosensor applications in healthcare; food safety; and environmental monitoring

(This special issue belongs to the Section B1: Biosensors)

Microelectronics Assembly and Packaging: Materials and Technologies, 3rd Edition

edited by

Liangxing Hu

and Peng Zhao

submission deadline 30 Jul 2026 | Viewed by 121 | Submission Open

Keywords: semiconductor packaging; advanced pakaging; chip and wire bonding technology; mixed-assembly technology; multichip modules (MCM); package-on-package (PoP); system-in-package (SiP); heterogeneous integration; chiplet interconnection; hybrid bonding; 2.5D (interposer); 3D (TSV/TGV); packaging materials; materials qualification

(This special issue belongs to the Section E：Engineering and Technology)

Novel Micromechanical Resonators, Filters, and MEMS/NEMS Transducers

edited by

Jing Wang

, Nelson Sepúlveda,

Philip Feng

and Guoan Wang

submission deadline 30 Jul 2026 | Viewed by 89 | Submission Open

Keywords: RF MEMS; micromechanical resonators; filters; oscillators; resonant sensors; MEMS resonator readout circuits

(This special issue belongs to the Section A：Physics)

Advanced Applications in Microrobots, 2nd Edition

edited by

Xinjian Fan

submission deadline 30 Jul 2026 | Viewed by 12 | Submission Open

Keywords: magnetic microrobots; micro-scale robotics; biomimetic robotics; microfluidics; microassembly; targeted drug delivery; micro-manipulation; soft robotics

(This special issue belongs to the Section A：Physics)

Microfluidics in Biomedical Research

edited by

Nan Xiang

submission deadline 31 Jul 2026 | Viewed by 79 | Submission Open

Keywords: microfluidics; artificial intelligence; point-of-care testing devices or instruments; biomedical research; emerging techniques

(This special issue belongs to the Section B：Biology and Biomedicine)

Piezoelectric Sensors, Actuators, Transducers, and Energy Harvesters

edited by

Lin Zhang

, Wenjuan Liu and

Dabin Lin

submission deadline 31 Jul 2026 | Viewed by 68 | Submission Open

Keywords: piezoelectric materials; MEMS; flexible sensors; transducers

(This special issue belongs to the Section A：Physics)

Recent Advancements in Micromachined Ultrasonic Transducers

edited by

Zhikang Li

and Jie Li

submission deadline 31 Jul 2026 | Viewed by 58 | Submission Open

Keywords: micromachined ultrasonic transducers (MUTs); PMUTs; CMUTs; low-power consumption; high performance; micro- and nano-manufacturing; applications of MUTs

(This special issue belongs to the Section A：Physics)

Advanced Magnetoelastic Immunosensors and Their Applications

edited by

Zhongyun Yuan

submission deadline 30 Aug 2026 | Viewed by 49 | Submission Open

Keywords: magnetoelastic sensors; magnetostrictive materials; magnetoelastic coupling; immunosensors; smart sensing

Displaying special issue 351-400 on page 8 of 8.

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