Advances in Pressure Sensors
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 15 September 2026 | Viewed by 10
Special Issue Editor
Interests: molecular dynamics simulation; sensor; silicon carbide; finite element method; flexible electronics; wearable devices; precision machining; MEMS; fiber spinning; composites; polymer processing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
In the era of smart sensors and the Internet of Things, advanced MEMS sensors have greatly enhanced convenience and opened up numerous possibilities for human life. This Special Issue centers on the latest developments in MEMS pressure sensors, bridging the divide between basic and applied sciences. It promotes interdisciplinary collaboration and the sharing of new discoveries in areas such as physics, chemistry, biology, materials science, and engineering—with a focus on microelectromechanical system (MEMS) fabrication techniques tailored for pressure sensing and bio-integrated pressure sensing devices, and their integration into wearable/implantable systems.
This Special Issue not only showcases the forefront of MEMS pressure sensor technologies—including miniaturized piezoresistive, capacitive, resonant, and optical pressure sensors with improved sensitivity, accuracy, and stability—but also fosters the exchange of innovative findings and ideas. By highlighting breakthroughs in flexible/stretchable pressure sensors for conformal contact, low-power designs for IoT nodes, and multi-parameter integrated sensing platforms that combine pressure with other modalities (e.g., temperature or strain), it seeks to inspire future research and development in next-generation pressure sensing architectures.
Ultimately, this collection aims to drive advancements in critical applications where precise pressure monitoring is pivotal: healthcare (e.g., continuous blood pressure tracking, intraocular pressure monitoring for glaucoma management, respiratory effort detection), environmental sensing (e.g., atmospheric pressure variations for weather forecasting, underwater pressure mapping), soft robotics (e.g., tactile feedback for safe human–robot interaction), and human–machine interfaces (e.g., gesture recognition via pressure-sensitive wearables). Through these innovations, the issue strives to improve quality of life and stimulate economic growth by accelerating technological adoption in emerging fields reliant on high-performance pressure sensing.
Dr. Xudong Fang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- micro/nanosensors
- MEMS sensors
- pressure sensors
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