Semiconductor Materials and Processing Technology
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 31 August 2026 | Viewed by 253
Editor
Interests: new materials; processing and design; integrated systems; 3D integration; semiconductor materials; process and integration; battery and energy materials; microstructural evolution; characterization
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Semiconductor materials and processing technology are widely employed in optical devices, electronic devices, sensors, energy, displays, and semiconductors. These semiconductor materials are deposited using metals, ceramics, dielectrics, carbon materials, composites, and hybrid materials and are widely utilized in the electronics industry, such as in the semiconductors mentioned above. In addition, these semiconductor processing technologies comprise various processes such as PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), ALD (Atomic Layer Deposition), sol–gel processing, electroplating, and electroless plating. The development of high-performance optics, energy, sensors, displays, and semiconductors requires the development of new thin film materials and processes. Therefore, this Special Issue aims to provide an overview of materials and processing technologies that can be employed in various new devices.
The scope of this Special Issue includes, but is not limited to, the following topics:
- Semiconductor processing technology;
- Semiconductor materials;
- Thin film processing;
- Sensor materials and processing;
- Optical and electronics materials;
- Energy materials and processing.
Prof. Dr. Sung Gyu Pyo
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- semiconductor processing
- deposition
- etching
- interconnect technology
- thin film processing
- process integration
- wafer manufacturing
- photolithography
- patterning
- packaging
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