Resistive Random Access Memory Devices: Mechanisms, Materials, Devices, and Applications

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 31 January 2026 | Viewed by 561

Special Issue Editors


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Guest Editor
Department of Electronic Engineering, Cheng-Shiu University, Kaohsiung, Taiwan
Interests: non-volatile resistor random memory devices; ferroelectric memory devices; thin films; functional ceramics applications
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Guest Editor
Department of Electronic Engineering, Southern Taiwan University of Science and Technology, Tainan 710301, Taiwan
Interests: electroceramics; thin films; piezoelectric ceramics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Nonvolatile resistance random access memory (RRAM) devices have garnered significant attention because of their simple structure, nonvolatile nature, rapid operation speed, multi-state capability, compact size, high packing density, and low power consumption. RRAM devices hold promising potential for applications in portable electronic systems, including personal digital assistants, mobile phones, and digital cameras, as well as in neuromorphic computing systems. Various materials have been explored for RRAM devices, such as chalcogenides, oxides, carbon, and organic compounds. Different mechanisms have been proposed to explain the resistive switching phenomena, including the formation/rupture of conducting filaments and carrier trapping/detrapping at defects. This special issue covers, but is not limited to, the following topics: resistive switching mechanisms, novel RRAM materials, novel RRAM device structures, and potential applications of RRAM devices. 

Prof. Dr. Kai-Huang Chen
Prof. Dr. Chien-Min Cheng
Guest Editors

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Keywords

  • RRAM
  • resistive switching
  • nonvolatile memory
  • neuromorphic computing

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Published Papers (1 paper)

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Research

18 pages, 6030 KB  
Article
Impact of Rapid Thermal Annealing and Oxygen Concentration on Symmetry Bipolar Switching Characteristics of Tin Oxide-Based Memory Devices
by Kai-Huang Chen, Chien-Min Cheng, Ming-Cheng Kao, Hsin-Chin Chen, Yao-Chin Wang and Yu-Han Tsai
Micromachines 2025, 16(8), 956; https://doi.org/10.3390/mi16080956 - 19 Aug 2025
Viewed by 406
Abstract
In this study, tin oxide (SnO2) resistive random-access memory (RRAM) thin films were fabricated using the thermal evaporation and radiofrequency and dc frequency sputtering techniques for metal–insulator–metal (MIM) structures. The fabrication process began with the deposition of a silicon dioxide (SiO [...] Read more.
In this study, tin oxide (SnO2) resistive random-access memory (RRAM) thin films were fabricated using the thermal evaporation and radiofrequency and dc frequency sputtering techniques for metal–insulator–metal (MIM) structures. The fabrication process began with the deposition of a silicon dioxide (SiO2) layer onto a silicon (Si) substrate, followed by the deposition of a titanium nitride (TiN) layer to serve as the bottom electrode. Subsequently, the tin oxide (SnO2) layer was deposited as the resistive switching insulator. Two types of top electrodes were developed to investigate the influence of different oxygen concentrations on the bipolar switching, electrical characteristics, and performance of memory devices. An aluminum (Al) top electrode was deposited using thermal evaporation, while a platinum (Pt) top electrode was deposited via dc sputtering. As a result, two distinct metal–insulator–metal (MIM) memory RRAM device structures were formed, i.e., Al/SnO2/TiN/SiO2/Si and Pt/SnO2/TiN/SiO2/Si. In addition, the symmetry bipolar switching characteristics, electrical conduction mechanism, and oxygen concentration factor of the tin oxide-based memory devices using rapid thermal annealing and different top electrodes were determined and investigated by ohmic, space-charge-limit-current, Schottky, and Poole–Frenkel conduction equations in this study. Full article
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