Special Issues

Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process. The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue policies and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.

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Additively Manufactured Microchannels: Microfluidics and Microscale Thermal Management
edited by
submission deadline 30 Jun 2026 | Viewed by 97 | Submission Open
Keywords: additive manufacturing; microchannel geometry optimization; innovative microchannel geometries; microscale thermal management; heat transfer enhancement; microfluidics
(This special issue belongs to the Section A:Physics)
Microfluidics-Based Drug Screening and Delivery Technology submission deadline 30 Jun 2026 | Viewed by 90 | Submission Open
Keywords: microfluidics; micro and nanotechnology; drug delivery; drug screening; drug carriers; microphysiological systems; transdermal drug delivery; microneedles; personalized medicine
(This special issue belongs to the Section B:Biology and Biomedicine)
Active Propelled Micro/Nano Technologies in Drug Delivery: Design, Fabrication and Applications
edited by
submission deadline 30 Jun 2026 | Viewed by 74 | Submission Open
Keywords: nano/microrobots; self-propelled; active propulsion; drug delivery; nanomedicine
(This special issue belongs to the Section B5: Drug Delivery System)
Alternative-Material Semiconductor Devices
edited by and Peng Ding
submission deadline 30 Jun 2026 | Viewed by 74 | Submission Open
Keywords: semiconductor device fabrication; wide-bandgap semiconductor devices; emerging semiconductor materials and devices; semiconductor device modeling and simulation; semiconductor devices for rf and power electronics; semiconductor optoelectronic devices; novel architectures of semiconductor devices
(This special issue belongs to the Section D:Materials and Processing)
Advanced Neuroelectronics and Its Applications
edited by Abijeet Mehta
submission deadline 30 Jun 2026 | Viewed by 66 | Submission Open
Keywords: neuroelectronics; bioelectronic medicine; neural interfaces; biosensors; conductive biomaterials; brain-computer interfaces; neurostimulation; tissue regeneration; organic electrochemical transistors; precision medicine  
(This special issue belongs to the Section B:Biology and Biomedicine)
Critical Materials and Components for High-Performance Magnetic Encoders in Robotics and Unmanned Systems
edited by
submission deadline 30 Jun 2026 | Viewed by 65 | Submission Open
Keywords: magnetic encoders; magnetic sensors; hard magnets; readout ICs; positioning accuracy; unmanned systems
(This special issue belongs to the Section A:Physics)
Quartz Resonators and Their Application in Frequency Devices and Sensors
edited by and Feng Zhu
submission deadline 30 Jun 2026 | Viewed by 58 | Submission Open
Keywords: quartz resonators; frequency stability; sensors; oscillators; multiphysics modeling; structural optimization; MEMS fabrication; electronic packaging
(This special issue belongs to the Section A:Physics)
Intelligent Hydrogels: Microdevices and Biomedical Applications
edited by , Xiangyu Liang and Xin Yang
submission deadline 30 Jun 2026 | Viewed by 55 | Submission Open
Keywords: intelligent hydrogels; stimuli-responsive hydrogels; self-healing hydrogels; controlled drug delivery; tissue engineering; biosensing and diagnostics; microdevices and microfluidics; lab-on-a-chip/organ-on-a-chip; microrobots and actuators; bioinspired hydrogels; translational hydrogel technologies
(This special issue belongs to the Section D2: Biomaterial Devices)
Advances in Bioprototyping Techniques submission deadline 30 Jun 2026 | Viewed by 55 | Submission Open
Keywords: bioprinting; biomaterials for prototyping; bioprototyping; multi-cellular and heterogeneous tissue models; integration of sensors and electronics; computational modeling and AI; low-cost and accessible platforms
(This special issue belongs to the Section B2: Biofabrication and Tissue Engineering)
Ferroelectric Materials, Devices and Applications
edited by Huan Liu and
submission deadline 30 Jun 2026 | Viewed by 45 | Submission Open
Keywords: ferroelectric; FeRAM; FeFET; memory; electro-optical
(This special issue belongs to the Section D:Materials and Processing)
Electrochemical Biosensors and Bioelectronic Microdevices for Point-of-Care and Wearable Applications
edited by Shuto Osaki and
submission deadline 30 Jun 2026 | Viewed by 44 | Submission Open
Keywords: electrochemical biosensors; nanomaterials; aptamer-based sensing; enzymatic and immune sensing; electrochemical impedance spectroscopy (EIS); voltammetry and amperometry; electrochemiluminescence (ECL); microfluidic and wearable platforms; point-of-care testing; surface engineering; wireless and IoT-enabled sensing; bio-battery; environmental and clinical diagnostics; microneedles 
(This special issue belongs to the Section B1: Biosensors)
Multiphase Microfluidics: Transport, Interfaces and Dynamics
edited by Bingqiang Ji and Chenliang Xia
submission deadline 30 Jun 2026 | Viewed by 33 | Submission Open
Keywords: multiphase microfluidics; interfacial dynamics; droplet; bubble; emulsions; phase change; microscale transport; cavitation; surface tension; wettability; microfabrication; thermal– fluid interaction; reactive multiphase flow; lab-on-a-chip; bioinspired microfluidics
Progress in Micro-Nano Additive Manufacturing submission deadline 30 Jun 2026 | Viewed by 31 | Submission Open
Keywords: 3D printing; micro– nano additive manufacturing; materials; modeling and simulation; characterization and performance; post-processing; surface polishing for AM; electrochemical additive manufacturing; applications
(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)
Advances in Power Microelectronics and Chips
edited by Zhi Lin
submission deadline 30 Jun 2026 | Viewed by 28 | Submission Open
Keywords: advanced silicon-based power devices; advanced wide bandgap semiconductor power devices; power integrated circuits; power integration technology; on-chip power supply; emerging materials in power chips
(This special issue belongs to the Section D:Materials and Processing)
Intelligent Control of Microsystems: From Nonlinear Dynamics to Soft Computing
edited by
submission deadline 30 Jun 2026 | Viewed by 25 | Submission Open
Keywords: nonlinear MEMS; automatic control; high-reliability; soft computing; quantum MEMS
Soft Embodied AI: The Convergence of Flexible Systems and Intelligent Microrobotics
edited by and Guoqiang Xu
submission deadline 30 Jun 2026 | Viewed by 22 | Submission Open
Keywords: soft embodied AI; flexible microsystems; intelligent microrobotics; soft microrobots; micro/nano fabrication; intelligent soft materials; microscale robotics integration; soft robotics applications
(This special issue belongs to the Section E:Engineering and Technology)
Advanced Oxide- and Carbon Nanotube-Based Transistors for Next-Generation Semiconductor Chips submission deadline 30 Jun 2026 | Viewed by 15 | Submission Open
Keywords: oxide transistors; carbon nanotube transistors; micro/nanofabrication technologies; next-generation semiconductor chips
(This special issue belongs to the Section D1: Semiconductor Devices)
Laser Precision Processing Technologies and Equipment for Aerospace Materials
edited by
submission deadline 30 Jun 2026 | Viewed by 12 | Submission Open
Keywords: aerospace materials; laser processing equipment; laser polishing; laser cutting; laser drilling; process technology
(This special issue belongs to the Section D:Materials and Processing)
Wearable Electronics and Sensory Devices
edited by Doga Doganay and Husnu Emrah Unalan
submission deadline 30 Jun 2026 | Viewed by 11 | Submission Open
Keywords: wearable electronics; flexible and stretchable sensors; self-powered sensors; skin-conformal electronics; soft robotics interfaces; physiological monitoring
(This special issue belongs to the Section E:Engineering and Technology)
Microsensors for Early Disease Diagnosis and Rapid Food Safety Testing
edited by
submission deadline 30 Jun 2026 | Viewed by 9 | Submission Open
Keywords: microsensors; bio-recognition elements; nanomaterials; medical diagnostics; food safety
(This special issue belongs to the Section B1: Biosensors)
Micro/Nanomotors: Design, Materials, Propulsion and Applications
edited by and Ming Luo
submission deadline 10 Jul 2026 | Viewed by 135 | Submission Open
Keywords: micro/nanomotor; fabrication; motion control; application
(This special issue belongs to the Section A:Physics)
Fiber Optic Sensors: From Materials to Applications
edited by
submission deadline 20 Jul 2026 | Viewed by 92 | Submission Open
Keywords: materials for fiber optic sensors; fiber Bragg grating; fiber sensor; flexible sensor; LMR/SPR sensor; optical sensor
(This special issue belongs to the Section A:Physics)
Advances in Nano/Micro Engineered & Molecular Systems
edited by Xiaosheng Zhang, Haitao Zhao, and
submission deadline 25 Jul 2026 | Viewed by 86 | Submission Open
Keywords: micro/nano electro-mechanical systems(M/NEMS); micro/nano/molecular fabrication; micro/nano robotics; micro/nano/molecular physical/chemical sensors/actuators; nano photonics and micro/molecular optical devices; micro/nano-composite materials and structures; micro/nano-bio-/medical devices and systems; functional nanomaterials and synthesis; micro/nano integrated devices/circuits/systems
Microelectronics Assembly and Packaging: Materials and Technologies, 3rd Edition
edited by and Peng Zhao
submission deadline 30 Jul 2026 | Viewed by 339 | Submission Open
Keywords: semiconductor packaging; advanced pakaging; chip and wire bonding technology; mixed-assembly technology; multichip modules (MCM); package-on-package (PoP); system-in-package (SiP); heterogeneous integration; chiplet interconnection; hybrid bonding; 2.5D (interposer); 3D (TSV/TGV); packaging materials; materials qualification
(This special issue belongs to the Section E:Engineering and Technology)
Novel Micromechanical Resonators, Filters, and MEMS/NEMS Transducers
edited by , Nelson Sepúlveda, and Guoan Wang
submission deadline 30 Jul 2026 | Viewed by 135 | Submission Open
Keywords: RF MEMS; micromechanical resonators; filters; oscillators; resonant sensors; MEMS resonator readout circuits
(This special issue belongs to the Section A:Physics)
Advanced Applications in Microrobots, 2nd Edition
edited by
submission deadline 30 Jul 2026 | Viewed by 67 | Submission Open
Keywords: magnetic microrobots; micro-scale robotics; biomimetic robotics; microfluidics; microassembly; targeted drug delivery; micro-manipulation; soft robotics
(This special issue belongs to the Section A:Physics)
Microfluidics in Biomedical Research
edited by
submission deadline 31 Jul 2026 | 1 articles | Viewed by 2297 | Submission Open
Keywords: microfluidics; artificial intelligence; point-of-care testing devices or instruments; biomedical research; emerging techniques
(This special issue belongs to the Section B:Biology and Biomedicine)
Piezoelectric Sensors, Actuators, Transducers, and Energy Harvesters
edited by , Wenjuan Liu and
submission deadline 31 Jul 2026 | Viewed by 133 | Submission Open
Keywords: piezoelectric materials; MEMS; flexible sensors; transducers
(This special issue belongs to the Section A:Physics)
Recent Advancements in Micromachined Ultrasonic Transducers
edited by and Jie Li
submission deadline 31 Jul 2026 | Viewed by 120 | Submission Open
Keywords: micromachined ultrasonic transducers (MUTs); PMUTs; CMUTs; low-power consumption; high performance; micro- and nano-manufacturing; applications of MUTs
(This special issue belongs to the Section A:Physics)
Acoustic Microfluidics: Design, Fabrication, and Applications
edited by and
submission deadline 31 Jul 2026 | Viewed by 93 | Submission Open
Keywords: acoustofluidics; microfluidics; bulk acoustic wave; surface acoustic wave; acoustic streaming; acoustic radiation force
(This special issue belongs to the Section A:Physics)
Emerging Trends in Optoelectronic Device Engineering, 2nd Edition
edited by Indu Sharma and Vasudeva Reddy Minnam Reddy
submission deadline 31 Jul 2026 | Viewed by 68 | Submission Open
Keywords: optoelectronics; 2D materials; thin films; semiconducting materials; quantum dots; photoluminescence; bandgap engineering; photovoltaics; optical sensors; light emitting diodes (LEDs); solar cells; photodetectors; photoelectrochemical; water splitting
Photonic and Optoelectronic Devices and Systems, 4th Edition
edited by
submission deadline 31 Jul 2026 | Viewed by 67 | Submission Open
Keywords: optical waveguide devices; photonic sensors; photodiodes; solar cells; lasers; optical switches; logic gates; light-emitting diodes; plasmonics; metamaterials; photonic crystals; wearables; non-linear photonics; photonics for AI and neuromorphic computing; qauntum photonics
(This special issue belongs to the Section A:Physics)
Integrated Photonics and Optoelectronics, 3rd Edition
edited by
submission deadline 31 Jul 2026 | Viewed by 29 | Submission Open
Keywords: active and passive photonic devices  ; nanoscale optical modulators and photodetectors  ; chip-integrated single-photon generation and detection  ; photonic interfaced hybrid quantum system  ; photonic computing and photonic quantum computing  ; advanced nanomaterial for photonic structure  ; on-chip mid-IR photonics  ; micro- and nanofabrication techniques
(This special issue belongs to the Section A:Physics)
RF and Power Electronic Devices and Applications, 2nd Edition
edited by and Yuqi Wei
submission deadline 31 Jul 2026 | Viewed by 24 | Submission Open
Keywords: gallium nitride HEMT; power electronics; RF and mmWave device; power converter
(This special issue belongs to the Section D:Materials and Processing)
Next-Generation Piezoelectric Films: Materials, Fabrication, and Applications
edited by Longfei Song
submission deadline 31 Jul 2026 | Viewed by 22 | Submission Open
Keywords: piezoelectric films; deposition methods; piezoelectric MEMS devices; piezoelectric energy harvesting
(This special issue belongs to the Section A:Physics)
Current and Emerging Microfabrication Techniques for Lab-on-a-Chip and Biomedical Microdevices: From Photolithography to 3D Printing
edited by
submission deadline 31 Jul 2026 | Viewed by 17 | Submission Open
Keywords: novel fabrication materials; fabrication techniques (molding; 3D printing; photolithography; nanofabrication; hot embossing; etc.); integration; sensor integration; three-dimensional microfluidics; hybrid devices; membrane-based microfluidic devices; paper-based microfluidic devices; fluid handling and automation
(This special issue belongs to the Section B:Biology and Biomedicine)
Micro Sensors and Devices for Ocean Engineering
edited by Chenyang Xue
submission deadline 31 Jul 2026 | Viewed by 16 | Submission Open
Keywords: advanced ocean sensing; marine microsensors; micro-nano fabrication
(This special issue belongs to the Section A:Physics)
Hydrodynamics of Micro Blood Vessels
edited by
submission deadline 31 Jul 2026 | Viewed by 15 | Submission Open
Keywords: micro/nano-fluidics; microvascular blood flow; micro/nanochannel flow; micro blood vessels; micro- and nano-channels; non-newtonian flow
(This special issue belongs to the Section B:Biology and Biomedicine)
Micro- and Nano-Engineered Biomaterials and Devices for Regenerative Medicine and Therapeutics
edited by and Yu Song
submission deadline 31 Jul 2026 | Viewed by 6 | Submission Open
Keywords: biomaterials for regenerative medicine; hydrogels and microneedle devices; smart and responsive therapeutic materials; microfluidic and 3D-bioprinted constructs; bioinspired therapeutic devices
(This special issue belongs to the Section B2: Biofabrication and Tissue Engineering)
Advanced Magnetoelastic Immunosensors and Their Applications
edited by
submission deadline 30 Aug 2026 | Viewed by 107 | Submission Open
Keywords: magnetoelastic sensors; magnetostrictive materials; magnetoelastic coupling; immunosensors; smart sensing
Smart Robots for Industrial Inspection: Integrating Micro-Technologies and Intelligent Systems
edited by , and Xiaoling Li
submission deadline 30 Aug 2026 | Viewed by 97 | Submission Open
Keywords: soft robot; micro robots; industrial robot; control strategy; measurement and inspection; intelligent operation and maintenance; advanced sensors and micro-sensors integration
(This special issue belongs to the Section E:Engineering and Technology)
MEMS Gas Sensors and Electronic Nose
edited by Wenfeng Shen and Jun Yu
submission deadline 31 Aug 2026 | Viewed by 62 | Submission Open
Keywords: MEMS semiconductor gas sensors; MEMS optical gas sensors; electronic nose and its applications
(This special issue belongs to the Section B:Biology and Biomedicine)
Neuromorphic Memory and Computing-in-Memory Architectures: From Devices to Systems
edited by and Jing Liu
submission deadline 10 Sep 2026 | Viewed by 176 | Submission Open
Keywords: neuromorphic devices; memory devices; computing-in-memory; memristor; synaptic electronics; analog neural computing; crossbar arrays; von Neumann bottleneck; edge intelligence; optoelectronic memory; photonic– electronic hybrid computing; hardware AI accelerators; intelligent sensing
(This special issue belongs to the Section A:Physics)
Advanced Packaging for Microsystem Applications, 4th Edition
edited by and
submission deadline 30 Sep 2026 | 1 articles | Viewed by 234 | Submission Open
Keywords: advanced packaging technology; MEMSs; reliability; NEMSs; packaging materials; modeling and simulation; design and manufacturing process; microsystems
(This special issue belongs to the Section A:Physics)
Fabrication, Reliability, Simulation, and Protection of Advanced Semiconductor Devices and Integrated Circuits: Enabled by Emerging Semiconductor Materials
edited by Xiyuan Feng and Yunlei Zhong
submission deadline 30 Sep 2026 | Viewed by 29 | Submission Open
Keywords: emerging semiconductor materials; advanced semiconductor devices; integrated circuits (ICs); fabrication processes; reliability engineering; multi-physics simulation; device protection strategies; wide-bandgap semiconductors (WBG); two-dimensional materials
(This special issue belongs to the Section D1: Semiconductor Devices)
Advances in Micro/Nano-Fabricated GaN-Based Semiconductor Devices: Materials, Processing, and Applications
edited by Lei Li
submission deadline 30 Sep 2026 | Viewed by 16 | Submission Open
Keywords: optoelectronic devices; electronic devices; material characterizations; device physics; device reliability
(This special issue belongs to the Section D1: Semiconductor Devices)
Advanced Functional Shape Memory Alloys and Their Applications submission deadline 31 Dec 2026 | Viewed by 11 | Submission Open
Keywords: shape memory alloys; superelasticity; martensitic transformation; thin films; microfabrication; smart actuators; elastocaloric effect; MEMS/NEMS; additive manufacturing
(This special issue belongs to the Section D:Materials and Processing)
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