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Micromachines
Special Issues
Advanced Packaging for Microsystem Applications, 4th Edition
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Advanced Packaging for Microsystem Applications, 4th Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 30 September 2026 | Viewed by 244

Special Issue Editors

Prof. Dr. Wenchao Tian

E-Mail Website
Guest Editor
School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, China
Interests: MEMS technology; electronic packaging and microassembly technology
Special Issues, Collections and Topics in MDPI journals
Dr. Yongkun Wang

E-Mail Website
Guest Editor
School of Mechano-Electronic Engineering, Xidian University, Xi’an 710000, China
Interests: MEMS technology; electronic packaging and microassembly technology; smart materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In line with fast-moving trends in microelectronic technology, recent years have seen the optimization of microsystems and their different electronic components towards reduced size and high performance, frequency, and reliability. However, significant challenges have arisen in the application of advanced packaging materials and techniques in MEMSs/NEMSs. For example, complex operating environments can significantly affect mechanical and electrical properties, greatly influencing the reliability of these devices and systems. Consequently, the physical properties, design, and preparation of novel packaging materials and techniques need further study to optimize micro-/nanodevices, as these design and manufacturing processes can directly affect the reliability, cost, and performance of these products. However, the modeling and simulation of electronic packaging, in lieu of experimentation, can overcome many of these problems.

Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on advanced packaging, materials, microsystems, the reliability of devices and systems, and micro-/nanodevices. Topics of interest might include, but are not limited to, the following:

  • Advanced packaging technology;
  • The reliability of devices and systems;
  • Advanced packaging materials;
  • MEMSs/NEMSs;
  • Microsystems.

Prof. Dr. Wenchao Tian
Dr. Yongkun Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced packaging technology
  • MEMSs
  • reliability
  • NEMSs
  • packaging materials
  • modeling and simulation
  • design and manufacturing process
  • microsystems

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Published Papers (1 paper)

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Research

14 pages, 4167 KB  
Article
Process Optimization for Metal-Contact Etching in 3D Integration Devices
by Sung Gyu Pyo
Micromachines 2025, 16(12), 1354; https://doi.org/10.3390/mi16121354 - 28 Nov 2025
Viewed by 129
Abstract
This study investigates a metal-contact etching process that differs from conventional device contact etching by focusing on the film-stack configuration and the associated super-contact etching characteristics. Because metal-contact etching is closely linked to both physical profiles and electrical performance, evaluating a single parameter [...] Read more.
This study investigates a metal-contact etching process that differs from conventional device contact etching by focusing on the film-stack configuration and the associated super-contact etching characteristics. Because metal-contact etching is closely linked to both physical profiles and electrical performance, evaluating a single parameter provides limited insight; thus, the physical profile characteristics of metal-contact etching and 3D-integrated super-contacts were comprehensively examined. In the first-step etch, the target depth in the wafer left region was approximately 2365 Å, and the bottom surface exhibited a desirable rounded profile. Following the removal of liner TEOS and nitride, the stopping margin was evaluated under three conditions: (1) metal-contact etching with a ~22 s target reduction, (2) a CMOS image-sensor baseline incorporating an interlayer-dielectric-reduction scheme, and (3) a high-selectivity condition achieved by increasing the C5F8/O2 ratio with a reduced etch target. Under all three conditions, the bit-line contact (BLC) nitride experienced punch-through. To address this limitation, a three-step etch sequence was implemented, in which the first two steps achieved the required etch depth and the final step utilized a high-selectivity over-etch to secure a sufficient stopping margin. This approach demonstrated robust process windows, favorable CD control, and reliable nitride stopping performance, thereby establishing a practical methodology for stable super-contact etching in advanced 3D-integrated logic applications. Full article
(This article belongs to the Special Issue Advanced Packaging for Microsystem Applications, 4th Edition)
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