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Micromachines
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Emerging Trends in Optoelectronic Device Engineering, 2nd Edition
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Emerging Trends in Optoelectronic Device Engineering, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 31 July 2026 | Viewed by 5311

Special Issue Editors

Dr. Indu Sharma

E-Mail Website
Guest Editor
Department of Materials Science and Engineering and Optoelectronics Convergence Research Center, Chonnam National University, Gwangju 61186, Republic of Korea
Interests: two dimensional materials; thin-films, chemical vapor deposition (CV); atomic layer deposition (ALD); heterostructures; interface/bandgap engineering; sensors; solar cells; device fabrication; optoelectronic devices
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Vasudeva Reddy Minnam Reddy

E-Mail Website
Guest Editor
School of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Gyeongbuk, Republic of Korea
Interests: nanomaterials; spectroscopy; thin films; solar cells
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The field of optoelectronic device engineering is currently experiencing rapid evolution, driven by continuous advancements in materials, fabrication techniques and diverse application domains. This Special Issue aims to comprehensively explore and showcase the latest breakthroughs and emerging trends that shape the landscape of optoelectronics. Recent developments span a broad spectrum of topics, encompassing novel materials such as quantum dots and nanomaterials, innovative fabrication methods aimed at enhancing performance and scalability and integration with cutting-edge technologies like artificial intelligence and the Internet of Things (IoT). Researchers are pushing the boundaries in ultrafast photonics for high-speed communication systems, advancing both organic and inorganic optoelectronic materials, and exploring diverse applications in biomedical imaging, environmental monitoring and renewable energy solutions.

The Special Issue invites contributions from researchers and experts in the field, welcoming original research articles, comprehensive reviews, insightful perspectives and innovative ideas. These contributions will highlight recent progress and forecast future directions in optoelectronic device engineering, fostering collaboration, inspiring new insights and propelling the field towards transformative advancements. By bringing together diverse perspectives and cutting-edge research, this Special Issue aims to serve as a pivotal platform for exchanging knowledge and shaping the future of optoelectronic technologies. We believe that through this collaboration, we can collectively address challenges and leverage opportunities to accelerate the development and deployment of next-generation optoelectronic devices.

We look forward to receiving your valuable contributions for this engaging Special Issue.

Dr. Indu Sharma
Prof. Dr. Vasudeva Reddy Minnam Reddy
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • optoelectronics
  • 2D materials
  • thin films
  • semiconducting materials
  • quantum dots
  • photoluminescence
  • bandgap engineering
  • photovoltaics
  • optical sensors
  • light emitting diodes (LEDs)
  • solar cells
  • photodetectors
  • photoelectrochemical
  • water splitting

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Related Special Issue

Published Papers (6 papers)

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Research

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34 pages, 7776 KB  
Article
Comparative Evaluation of Optical Alignment Algorithms for Integrated Probe Cards in Photonic Wafer Testing
by Mehdi Bejani, Alessia Galli, Riccardo Vettori, Marco Mauri and Stefano Mariani
Micromachines 2026, 17(5), 592; https://doi.org/10.3390/mi17050592 (registering DOI) - 12 May 2026
Viewed by 118
Abstract
Wafer-level testing of Photonic Integrated Circuits (PICs) represents a critical throughput bottleneck in silicon photonics manufacturing, particularly as co-packaged optics demand testing of thousands of optical I/O per wafer. This work introduces optimized alignment algorithms for the Technoprobe Eclipse Dynamic probe card system, [...] Read more.
Wafer-level testing of Photonic Integrated Circuits (PICs) represents a critical throughput bottleneck in silicon photonics manufacturing, particularly as co-packaged optics demand testing of thousands of optical I/O per wafer. This work introduces optimized alignment algorithms for the Technoprobe Eclipse Dynamic probe card system, which integrates electrical probes and a piezoelectrically actuated fiber array unit within a single probe head, eliminating external positioning equipment. We systematically evaluate seven alignment algorithms: Reference Coarse Scan, Reference Coarse+Fine Scan, Cross Scan, Local and Global Bayesian Optimization, Variable and Fixed Gradient Ascent. The evaluation is made across 72 simulated test cases derived from eight experimental datasets through systematic spatial windowing, combined with experimental validation. Performance is assessed under four operating regimes—high-speed (HS) and low-speed (LS) operation, each with or without hysteresis compensation (H/NH). Experimental validation across eight die positions confirms 100% success rate for both Local Bayesian (98.24% accuracy in 99.87 arbitrary units (a.u.)) and Fixed Gradient (99.18% accuracy in 154.01 a.u.) baseline algorithms. Comprehensive simulation results with improved algorithms across all four scenarios reveal distinct performance characteristics. Fixed Gradient achieves the highest reliability (95.8%) with 99.4% average accuracy across all operating conditions. Variable Gradient provides the fastest alignment (1.18 a.u. in HS-NH) with 90.3% reliability. Local Bayesian demonstrates 94.4% reliability with intermediate performance. Global Bayesian Optimization achieves the best sample efficiency (average 24 steps) but exhibits scenario-dependent reliability ranging from 88.9% (HS-H, LS-H) to 93.1% (LS-NH). For the ideal production scenario, high speed with effective hysteresis compensation (HS-NH), Fixed Gradient emerges as the optimal choice, delivering 95.8% reliability with 1.44 a.u. alignment time, resulting in the best success rate while being nearly as fast as the fastest method. Variable Gradient achieves the absolute fastest alignment (1.18 a.u.) but with 5.5% lower reliability (90.3%), making it suitable only for applications tolerating higher failure rates. Under realistic production conditions with uncompensated hysteresis (HS-H), Fixed Gradient maintains its advantage (95.8% reliability, 3.32 a.u.), while Global Bayesian degrades significantly (88.9% reliability, 4.29 a.u.). Statistical analysis using data profiles validates these methods for high-volume PIC manufacturing, with the Eclipse Dynamic system demonstrating per-die optical alignments in sub-second timescales using open-loop control hardware. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
19 pages, 1073 KB  
Article
An Analysis of Diffracted Mode Outcoupling in the Context of Optical Gain Measurements of Organic Thin Films: A Diffracted Emission Profile Method
by Thilo Pudleiner, Jan Hoinkis and Christian Karnutsch
Micromachines 2026, 17(2), 153; https://doi.org/10.3390/mi17020153 - 23 Jan 2026
Viewed by 511
Abstract
The sustained interest in efficient, low-cost, and straightforward-to-manufacture lasers has prompted intense research into organic semiconductor laser emitter materials in recent decades. The main focus of this research is determining the optical gains and losses of amplified spontaneous emission (ASE) in order to [...] Read more.
The sustained interest in efficient, low-cost, and straightforward-to-manufacture lasers has prompted intense research into organic semiconductor laser emitter materials in recent decades. The main focus of this research is determining the optical gains and losses of amplified spontaneous emission (ASE) in order to describe materials by their amplification signature. A method that has been used for decades as the standard technique for determining gain characteristics is the variable-stripe-length (VSL) method. The success of the VSL method has led to the development of further measurement techniques. These techniques provide a detailed insight into the nature of optical amplification. One such method is the scattered emission profile (SEP) method. In this study, we present an extension of the SEP method, the Diffracted Emission Profile (DEP) method. The DEP method is based on the detection of ASE by partial decoupling of waveguide modes diffracted by a one-dimensional grating integrated into a planar waveguide. Diffraction causes a proportion of the intensity to exit the waveguide, transferring the growth and decay process of the waveguide mode to the transverse mode profile of the diffracted mode. In the present article, an approach to determine the amplification signature of an organic copolymer is presented, utilizing partial decoupled radiation. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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21 pages, 6253 KB  
Article
Design of an Afocal Telescope System Integrated with Digital Imaging for Enhanced Optical Performance
by Yi-Lun Su, Wen-Shing Sun, Chuen-Lin Tien, Yen-Cheng Lin and Yi-Hong Liu
Micromachines 2026, 17(1), 62; https://doi.org/10.3390/mi17010062 - 31 Dec 2025
Viewed by 932
Abstract
This study presents the design and optimization of a digital-imaging afocal telescope system that integrates an afocal telescope architecture with an imaging optical subsystem. The proposed system employs a combination of spherical and aspherical optical elements to enhance imaging flexibility, reduce aberrations, and [...] Read more.
This study presents the design and optimization of a digital-imaging afocal telescope system that integrates an afocal telescope architecture with an imaging optical subsystem. The proposed system employs a combination of spherical and aspherical optical elements to enhance imaging flexibility, reduce aberrations, and ensure effective system coupling. Proper pupil matching is achieved by aligning the exit pupil of the afocal telescope with the entrance pupil of the imaging system, ensuring minimal vignetting and optimal energy transfer. Circular apertures and lens elements are used throughout the system to simplify alignment and minimize pupil-matching errors. The complete system comprises three imaging optical subsystems and a digital camera module, each independently optimized to ensure balanced optical performance. The design achieves an overall magnification of 16×, with near-diffraction-limited quality confirmed by an RMS wavefront error of 0.0474λ and a Strehl ratio of 0.915. The modulation transfer function (MTF) reaches 0.42 at 80 lp/mm, while the distortion remains below 4.87%. Chromatic performance is well controlled, with maximum lateral color deviations of 1.007 µm (short-to-long wavelength) and 1.52 µm (short-to-reference wavelength), evaluated at 656 nm, 587 nm, and 486 nm. The results demonstrate that the proposed digital-imaging afocal telescope system provides high-resolution, low-aberration imaging suitable for precision optical applications. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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14 pages, 1149 KB  
Article
Thermal Analysis and Hybrid Compensation Design of a 10× Optical Zoom Periscope Lens for Smartphones
by Yi-Hong Liu, Chuen-Lin Tien, Yi-Lun Su, Wen-Shing Sun and Ying-Shun Hsu
Micromachines 2026, 17(1), 35; https://doi.org/10.3390/mi17010035 - 28 Dec 2025
Viewed by 803
Abstract
This study presents an optical and thermal design for a compact 10× periscope zoom lens suitable for smartphones, employing a hybrid thermal compensation scheme to ensure stable imaging performance over a wide range of temperatures. Our proposed zoom optics system integrates passive and [...] Read more.
This study presents an optical and thermal design for a compact 10× periscope zoom lens suitable for smartphones, employing a hybrid thermal compensation scheme to ensure stable imaging performance over a wide range of temperatures. Our proposed zoom optics system integrates passive and active compensation mechanisms, further enhancing thermal stability through the use of a curved image sensor. Passive compensation is achieved through the selection of low-G optical materials and an optimized structural configuration. In contrast, active compensation dynamically adjusts the zoom group position in response to changes in ambient temperature. Optical simulations confirm that this 10× periscope zoom lens, composed of a prism, eight aspherical lenses, and two parallel plates, maintains diffraction-limited resolution and less than 2% distortion at all zoom positions (Zoom 1 to Zoom 6), achieving a total depth of 4.96 mm. Thermal analysis at temperatures ranging from −20 °C to 60 °C demonstrates that the optimized design, utilizing a curved sensor (Design type 3), achieves an average MTF of 0.58 and an average degradation rate of only 12.8%, exhibiting excellent non-thermal performance. These results highlight the effectiveness of the proposed novel hybrid thermal compensation strategy and surface sensor integration in realizing high-magnification, thermally stable periscope optics for next-generation smartphone imaging systems. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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14 pages, 61684 KB  
Article
A CMOS-Compatible Silicon Nanowire Array Natural Light Photodetector with On-Chip Temperature Compensation Using a PSO-BP Neural Network
by Mingbin Liu, Xin Chen, Jiaye Zeng, Jintao Yi, Wenhe Liu, Xinjian Qu, Junsong Zhang, Haiyan Liu, Chaoran Liu, Xun Yang and Kai Huang
Micromachines 2026, 17(1), 23; https://doi.org/10.3390/mi17010023 - 25 Dec 2025
Viewed by 590
Abstract
Silicon nanowire (SiNW) photodetectors exhibit high sensitivity for natural light detection but suffer from significant performance degradation due to thermal interference. To overcome this limitation, this paper presents a high-performance, CMOS-compatible SiNW array natural light photodetector with monolithic integration of an on-chip temperature [...] Read more.
Silicon nanowire (SiNW) photodetectors exhibit high sensitivity for natural light detection but suffer from significant performance degradation due to thermal interference. To overcome this limitation, this paper presents a high-performance, CMOS-compatible SiNW array natural light photodetector with monolithic integration of an on-chip temperature sensor and an embedded intelligent compensation system. The device, fabricated via microfabrication techniques, features a dual-array architecture that enables simultaneous acquisition of optical and thermal signals, thereby simplifying peripheral circuitry. To achieve high-precision decoupling of the optical and thermal signals, we propose a hybrid temperature compensation algorithm that combines Particle Swarm Optimization (PSO) with a Back Propagation (BP) neural network. The PSO algorithm optimizes the initial weights and thresholds of the BP network, effectively preventing the network from getting trapped in local minima and accelerating the training process. Experimental results demonstrate that the proposed PSO-BP model achieves superior compensation accuracy and a significantly faster convergence rate compared to the traditional BP network. Furthermore, the optimized model was successfully implemented on an STM32 microcontroller. This embedded implementation validates the feasibility of real-time, high-accuracy temperature compensation, significantly enhancing the stability and reliability of the photodetector across a wide temperature range. This work provides a viable strategy for developing highly stable and integrated optical sensing systems. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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Review

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44 pages, 5347 KB  
Review
Solution-Processed OLEDs: A Critical Review and Methodology Proposal for Stack Optimization
by Yassine Chiadmi, Paul-Vahe Cicek and Ricardo Izquierdo
Micromachines 2026, 17(2), 217; https://doi.org/10.3390/mi17020217 - 5 Feb 2026
Cited by 2 | Viewed by 1580
Abstract
Solution-processed OLEDs represent a low-cost, scalable alternative to vacuum-deposited devices, particularly for flexible and large-scale applications. However, selecting compatible materials for each layer remains a complex task, further complicated by inconsistent documentation, solvent interactions, and limited reproducibility across the literature. This work presents [...] Read more.
Solution-processed OLEDs represent a low-cost, scalable alternative to vacuum-deposited devices, particularly for flexible and large-scale applications. However, selecting compatible materials for each layer remains a complex task, further complicated by inconsistent documentation, solvent interactions, and limited reproducibility across the literature. This work presents a literature review and critical analysis of materials, solvents, and fabrication methods involved in solution-processed OLEDs, with particular attention to layer formulation, solvent orthogonality, and processing constraints. A Monte Carlo-based optimization framework is introduced as a proof of concept, aiming to formalize stack selection and explore viable combinations based on empirical constraints. The critical analysis highlights recurring issues in the field and advocates for a more structured, reproducibility-oriented approach to OLED design. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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