Advances in Semiconductor Power Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 30 September 2026 | Viewed by 755
Special Issue Editors
Interests: semiconductor devices; quantum computing; nanofabrication; machine learning
Special Issues, Collections and Topics in MDPI journals
Interests: cryogenic CMOS; device modeling; reliability physics; advance CMOS technology; design technology cooptimization
Special Issue Information
Dear Colleagues,
This Special Issue focuses on recent advances in semiconductor power devices, emphasizing integrated approaches that combine device design, experimental characterization, fabrication technologies, physics-based modeling, numerical simulation, and artificial intelligence-enabled methodologies. As power electronics continue to play a critical role in energy conversion, electrification, and sustainable technologies, improving device performance, system efficiency, and long-term reliability has become increasingly important. We invite contributions addressing innovative device architectures, material and process developments, advanced fabrication strategies, and experimental studies that reveal transport mechanisms, degradation behavior, and performance limits. Particular interest is given to multi-scale modeling and simulation frameworks that bridge material properties, device physics, and circuit- or system-level operation. Data-driven approaches, including machine learning and AI-assisted design, optimization, and reliability prediction, are especially encouraged, as they are emerging tools to accelerate discovery and reduce development cycles. Topics of interest include, but are not limited to, wide-bandgap and ultra-wide-bandgap devices, thermal and electrical reliability, packaging and integration challenges, system-level co-design, digital twins, and AI-assisted characterization and manufacturing. Both fundamental studies and application-oriented research are welcome, as we aim to advance the next generation of efficient, robust, and intelligent power semiconductor technologies.
Dr. Zeheng Wang
Dr. Zirui Wang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
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Keywords
- semiconductor power devices
- wide-bandgap devices
- ultra-wide-bandgap devices
- integrated circuits (ICs)
- fabrication processes
- reliability engineering
- advanced packaging
- emerging semiconductor materials
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