Microwave Passive Components, 3rd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 78
Special Issue Editors
Interests: THz passive devices; THz sensing and communication; electromagnetic and acoustic-based biomedical imaging and sensing
Special Issues, Collections and Topics in MDPI journals
Interests: dielectric properties measurement; programmable metasurface; vacuum electronic devices; millimeter-wave devices
Interests: vacuum electronic devices; millimeter-wave/THz passive devices; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Interests: vacuum electronic devices; passive pulse compressor; microwave biosensor; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Nowadays, micro-, millimeter- and terahertz-wave devices and systems are widely used in various aspects of life, such as in 5G/6G communication, vehicle imaging radar, medical, bio-science, security, etc. As is well known, microwave passive components play an important role in the design and application of these devices and systems. Particularly with the development of advanced machining technologies, such as the micro-electro-mechanical system (MEMS), 3D printing, and micro-/nano-machining, the machining accuracy and ability of the passive components have been significantly improved. In addition, over the past two decades, novel concepts and mechanisms have been continually introduced from within or beyond the field of micromachines, which include meta-materials, vortex electromagnetic waves, and spoof surface plasmons. This has resulted in microwave passive devices/components entering a new stage, controlled by information coding. This indicates that the performance of microwave passive devices still has great potential in the future, which may contribute to the miniaturization and integration of RF circuits and devices. This Special Issue is devoted to continuing the exploration for research papers, short communications, and review articles focusing on the theory, modeling, simulation, measurement and applications of passive components, circuits, devices and systems in the microwave-, millimeter-wave and terahertz-wave bands.
We look forward to receiving your contributions to this Special Issue.
- Theory, modeling, fabrication, measurement and applications;
- Microwave-, millimeter- and terahertz-wave passive component/devices applied in communication, radar and other systems;
- Passive component/devices in antennas, filters, biosensors, vacuum electronic devices, pulse compressor, particle accelerator, etc.;
- Other work related to microwave devices.
Dr. Lin Huang
Guest Editor
Dr. Weijie Wang
Guest Editor Assistant
Dr. Guoxiang Shu
Prof. Dr. Guo Liu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- theory, modeling, fabrication, measurement and applications
- microwave-, millimeter- and terahertz-wave passive component/devices applied in communication, radar and other systems
- passive component/devices in antennas, filters, biosensors, vacuum electronic devices, pulse compressor, particle accelerator, etc.
- other work related to microwave devices
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