Microwave Passive Components, 3rd Edition

Dear Colleagues,

Nowadays, micro-, millimeter- and terahertz-wave devices and systems are widely used in various aspects of life, such as in 5G/6G communication, vehicle imaging radar, medical, bio-science, security, etc. As is well known, microwave passive components play an important role in the design and application of these devices and systems. Particularly with the development of advanced machining technologies, such as the micro-electro-mechanical system (MEMS), 3D printing, and micro-/nano-machining, the machining accuracy and ability of the passive components have been significantly improved. In addition, over the past two decades, novel concepts and mechanisms have been continually introduced from within or beyond the field of micromachines, which include meta-materials, vortex electromagnetic waves, and spoof surface plasmons. This has resulted in microwave passive devices/components entering a new stage, controlled by information coding. This indicates that the performance of microwave passive devices still has great potential in the future, which may contribute to the miniaturization and integration of RF circuits and devices. This Special Issue is devoted to continuing the exploration for research papers, short communications, and review articles focusing on the theory, modeling, simulation, measurement and applications of passive components, circuits, devices and systems in the microwave-, millimeter-wave and terahertz-wave bands.

We look forward to receiving your contributions to this Special Issue.

• Theory, modeling, fabrication, measurement and applications;
• Microwave-, millimeter- and terahertz-wave passive component/devices applied in communication, radar and other systems;
• Passive component/devices in antennas, filters, biosensors, vacuum electronic devices, pulse compressor, particle accelerator, etc.;
• Other work related to microwave devices.

Dr. Lin Huang
Guest Editor

Dr. Weijie Wang
Guest Editor Assistant

Dr. Guoxiang Shu
Prof. Dr. Guo Liu
Guest Editors

Manuscript Submission Information

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