Advanced Microwave Devices and RF Chips: Design, Microfabrication, and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: 25 March 2027
Special Issue Editor
Interests: microwave sensors; microwave detectors; microwave filters; microwave resonators; microwave measurement
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Microwave, millimeter-wave, and terahertz technologies are widely used in modern wireless communications, radar, aerospace, satellite communications, intelligent sensing, industrial monitoring, biomedical engineering, and Internet of Things applications. The rapid development of 5G/6G communication systems, high-density RF front ends, miniaturized sensing platforms, and advanced detection systems has imposed higher requirements on the performance, integration, and reliability of microwave devices and RF chips, driving continuous innovation in device structures, circuit topologies, material systems, microfabrication, packaging technologies, and system-level applications. In recent years, emerging concepts and technologies such as metamaterials, substrate-integrated waveguides, spoof surface plasmon structures, microfluidic microwave sensing, AI-assisted RF design, multi-physics modeling, on-wafer characterization, and heterogeneous integration have further expanded the design space of microwave devices and RF chips. This Special Issue, entitled “Advanced Microwave Devices and RF Chips: Design, Microfabrication, and Applications”, aims to provide a platform for researchers to present the latest advances in microwave devices, RF chips, integrated passive and active components, microfabrication technologies, and their practical applications. We welcome high-quality original research articles and reviews covering the theory, modeling, simulation, design, fabrication, packaging, measurement, and application of microwave, millimeter-wave, and terahertz devices, circuits, chips, and systems.
I look forward to receiving your submissions and contributions to this Special Issue.
Prof. Dr. Cong Wang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
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Keywords
- theory, modeling, fabrication, measurement and applications of microwave devices and RF chips
- microwave devices and RF chips for communication, radar, and related systems
- microwave devices in antennas, filters, RF sensors, power amplifiers, integrated passive devices
- terahertz technologies and devices
- microwave and millimeter-wave integrated circuits
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