September 2022 - 140 articles
The high-k-based MOS-like capacitors are a promising approach for the domain of non-volatile memory devices, which currently is limited by SiO2 technology and cannot face the rapid downsizing of the electronic device trend. In this paper, we prepare...
Carbon-based composite conductive ink (3CI) has some challenges to its properties. Here, combined with the application of 3CI on silicon keypads, a series of studies on the electrical, mechanical and thermal performance of 3CI has been conducted by a...
Electromagnetic waves show rapid development in electronics, telecommunications, and the military. One of the efforts to overcome the effects of electromagnetic interference is by developing microwave-absorbing materials. Barium hexaferrite is the be...
The manipulation of magnetic anisotropy represents the fundamental prerequisite for the application of magnetic materials. Here we present the vectorial magnetic properties of nanostructured systems and thin films of Fe and FeCo prepared on linearly...
Advanced semiconductor materials and films are building blocks for multifunctional devices and circuits, integrated optoelectronic chips, and high-throughput communications, which have proved basic material platforms for nanoscience and technologies...
In the present work, Cu/Cr thin films were deposited on substrates of a different nature (Si, Glass, Bk7, and ITO) through a thermal evaporation deposition method. Non-contact atomic force microscopy (AFM) was used to obtain 3D AFM topographical maps...
Tungsten doping is critical for the wear resistance and application of High-Chromium Cast Iron (HCCI). A series of investigations of (Fe, Cr, W)7C3 carbides were performed by first principles calculations and experimental analysis. The calculated res...
In the present study, the surface composite Al359/Si3N4/Eggshell is prepared by friction stir processing (FSP). The effect of reinforced particle volume fraction on the microstructural and tribological properties of the Al359/Si3N4/Eggshell surface c...
The precise analysis of the overall mechanical performance of prestressed concrete cylinder pipes (PCCPs) with broken wires is a complicated problem. In this article, powerful finite element numerical means are applied to solve this problem. Firstly,...
Due to the huge difference in thermophysical properties, it is difficult to obtain a defect-free bonding interface between copper and steel. A Cu-Ni-Ti interlayer was added between a TiC-reinforced copper matrix composite coating and Q235 steel in th...
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