Ultra-Precision Machining of Difficult-to-Machine Materials

Dear Colleagues,

Difficult-to-machine materials, such as semiconductor, laser crystal, engineering ceramics, optical glass, superalloys, and composite materials, have been widely used in aerospace, 5G networks, and new energy vehicles owing to their excellent mechanical properties and steady chemical properties. For these advanced applications, these materials must be shaped into smooth substrates with high surface integrity using precision and ultra-precision machining technologies such as grinding, lapping, polishing, cutting, etc. However, these materials have high brittleness, high hardness, and high elasticity which pose great challenges for efficient machining. Severe surface and subsurface damage and cutting tool wear are easily generated during the machining process, which inevitably shortens the accuracy and service life of the components and increases the production costs. Understanding the mechanical properties, revealing the damage evolution and material removal mechanism in micro- and nanoscales, exploring innovative machining technology, and optimizing machining process parameters are of great significance to realize the high-efficiency and precision machining of difficult-to-machine materials. This collection aims at summarizing the frontier research on processing and surface integrity characterization of difficult-to-machine materials. The scope of this Special Issue includes but is not limited to:

• Precision machining technology of difficult-to-machine materials, such as grinding, polishing, lapping, cutting, etc.;
• In-depth characterization to reveal damage evaluation and removal behaviors that involved in machining processes;
• Numerical simulation of the material deformation and removal process;
• Surface engineering when it relates specifically to a manufacturing process;
• Design of cutting tools.

Dr. Chen Li
Guest Editor

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