Ultra-Precision Machining of Difficult-to-Machine Materials—Second Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 August 2025 | Viewed by 394
Special Issue Editor
Interests: ultra-precision machining; grinding; cutting; nanoscratch; brittle material
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Following the remarkable success of the first edition of this topic, entitled “Ultra-Precision Machining of Difficult-to-Machine Materials”, we are pleased to announce this second edition.
Difficult-to-machine materials, such as semiconductors, laser crystals, engineering ceramics, optical glass, superalloys, and composite materials, have been widely used in aerospace, 5G networks, and new energy vehicles owing to their excellent mechanical properties and steady chemical properties. For these advanced applications, these materials must be shaped into smooth substrates with high surface integrity using precision and ultra-precision machining technologies such as grinding, lapping, polishing, cutting, etc. However, these materials have high brittleness, high hardness, and high elasticity, which pose great challenges for efficient machining. Severe surface and subsurface damage and cutting tool wear are easily generated during the machining process, which inevitably shortens the accuracy and service life of the components and increases the production costs. Understanding the mechanical properties, revealing the damage evolution and material removal mechanism in micro- and nanoscales, exploring innovative machining technology, and optimizing machining process parameters are of great significance to realize the high-efficiency and precision machining of difficult-to-machine materials. This Special Issue aims to summarize the frontier research on processing and surface integrity characterization of difficult-to-machine materials. The scope of this Special Issue includes, but is not limited to, the following:
- Precision machining technology of difficult-to-machine materials, such as grinding, polishing, lapping, cutting, etc.;
- In-depth characterization to reveal damage evaluation and removal behaviors that involved in machining processes;
- Numerical simulation of the material deformation and removal process;
- Surface engineering when it relates specifically to a manufacturing process;
- Design of cutting tools.
We look forward to receiving your contributions.
Dr. Chen Li
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- ultra-precision machining
- grinding
- polishing
- cutting
- nanoscratch
- material removal mechanism
- difficult-to-machine material
- brittle material
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