CMOS MEMS: Design, Fabrication and Applications

Dear Colleagues,

It is our great pleasure to invite you to contribute to this Special Issue, which explores the dynamic intersection of materials science and micro-device engineering. We look forward to receiving your innovative research and sharing it with our global readership.

The relentless demand for miniaturized, intelligent systems has driven the evolution of multifunctional thin-film devices, establishing them as the cornerstone of next-generation microelectronics. This Special Issue, featuring the theme "CMOS MEMS: Design, Fabrication and Applications," explores the cutting-edge integration of thin-film fundamentals with advanced micro-electromechanical systems.

While traditional silicon-based CMOS-MEMS offer unmatched precision, scalable fabrication and powerful on-chip signal processing, emerging frontiers—such as wearable bioelectronics, soft robotics and harsh-environment sensing—demand more versatile solutions. Multifunctional thin films serve as the critical bridge. By incorporating advanced functional layers (e.g., piezoelectric oxides, 2D materials and organic semiconductors) into both robust silicon and emerging non-silicon MEMS (like polymers and glass), researchers can create unprecedented hybrid architectures.

This issue highlights the journey from fundamental interfacial physics to scalable heterogeneous integration. We invite papers addressing challenges in hybrid microfabrication, interface engineering and advanced packaging. Ultimately, this collection aims to demonstrate how seamlessly merging the computational power of standard CMOS with the mechanical versatility of hybrid thin-film MEMS is shaping the future of the Artificial Intelligence of Things, smart optoelectronics and personalized biomedical devices.

Dr. Shenyong Yang
Prof. Dr. Nicola Pio Belfiore
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Publisher’s Notice

Following discussions between the Micromachines Editorial Office and the Guest Editor, a new Guest Editor, Prof. Dr. Nicola Pio Belfiore, has been added to the Special Issue. This change has been approved by the Micromachines Editorial Board, and the Special Issue website has been updated accordingly on 10 October 2026. The Special Issue will continue to be handled by the current Guest Editors in accordance with MDPI’s Special Issue and editorial policies.