Advanced Computer Science and Intelligent Systems Innovations

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 30 April 2027 | Viewed by 68

Special Issue Editors


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Guest Editor
Department of Complex Systems, The Faculty of Electrical and Computer Engineering, Rzeszow University of Technology, 35-959 Rzeszow, Poland
Interests: computer network; Industry 4.0; Internet of Things; intelligent manufacturing
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Computing, University of Wollongong, GIFT City Campus, Gandhinagar 382050, Gujarat, India
Interests: advanced computer vision; machine learning; data science

Special Issue Information

Dear Colleagues,

We are pleased to invite you to submit your original research contributions to the Special Issue “Advanced Computer Science and Intelligent Systems Innovations” in Electronics.

This Special Issue is inspired by, and is a follow-up to, the FedCSIS 2025 conference. It aims to gather selected and extended high-quality papers presenting recent advances in computer science, intelligent systems, artificial intelligence, data processing, cybersecurity, networking, software engineering, and related application domains. However, while being organized in connection with FedCSIS 2025, this Special Issue is open to all researchers whose work falls within the thematic scope of the issue. We warmly welcome original and high-quality submissions from the broader scientific community, including contributions not presented at the conference, as long as they offer clear scientific value, novelty, and relevance to the field.

Concerning the scope of the Special Issue, we particularly welcome contributions that demonstrate novel methods, architectures, algorithms, models, and practical implementations addressing current challenges in advanced digital systems and intelligent computing. Interdisciplinary works combining theoretical rigor with application-oriented innovation are especially encouraged.

We warmly encourage you to consider this opportunity to further develop and disseminate your research within an international journal forum.

We look forward to receiving your contributions.

Dr. Andrzej Paszkiewicz
Dr. Chintan Bhatt
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced computer science
  • intelligent systems
  • artificial intelligence
  • machine learning
  • data analytics
  • cybersecurity
  • distributed systems
  • edge computing
  • Internet of Things
  • software engineering

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Published Papers

This special issue is now open for submission.
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