Next-Generation Engineering: IoT, Digital Twin, and AI-Driven Tolerance Optimization

Dear Colleagues:

The rapid advancement of digital technologies has ushered in a new era of intelligent and interconnected systems. The convergence of the Internet of Things (IoT), digital twin (DT), and artificial intelligence (AI) is reshaping various domains, including manufacturing, healthcare, smart cities, and precision engineering. IoT enables real-time data collection from physical environments, digital twins provide virtual replicas for advanced simulation and predictive analysis, while AI enhances decision-making and automation. One critical aspect in these domains is tolerance design, ensuring system reliability, efficiency, and performance. By integrating AI with IoT and digital twin technologies, researchers and practitioners can achieve unprecedented accuracy in tolerance analysis and optimization, reducing production costs and improving system robustness. Given the growing complexity of modern systems, advancing research in this multidisciplinary area is crucial for technological progress and industrial competitiveness.

This Special Issue aims to bring together researchers and industry experts to explore innovative methodologies, frameworks, and applications at the intersection of IoT, digital twin, AI, and tolerance design. The focus aligns with the journal’s scope by emphasizing cutting-edge advancements in smart systems, cyber–physical integration, and intelligent decision-making. This Special Issue will contribute to the broader understanding of how emerging technologies can improve design precision, predictive maintenance, and overall system efficiency by fostering discussions on theoretical and applied research. Topics of interest include, but are not limited to, the following:

• IoT and Digital Twin for Smart Manufacturing: Applications of IoT and digital twin in industrial automation, predictive maintenance, and quality control.
• AI-Driven Tolerance Optimization: Machine learning and deep learning approaches for improving tolerance design and predictive modeling.
• Cyber–Physical Systems and Tolerance Design: Integrating AI, IoT, and digital twin into engineering systems to enhance accuracy and reliability.
• Complex Network Science for IoT and Digital Twin Design and Development: Representing IoT and digital twins as complex and evolving networks that adapt on real-time data, using network-based AI models to enhance tolerance design, fault tolerance, and resilience.
• Standards and Frameworks: Emerging protocols and guidelines for implementing AI-enhanced tolerance design in IoT and digital twin environments.
• Case Studies and Industrial Applications: Practical implementations and real-world case studies demonstrating the impact of these technologies in various sectors.
• Security and Resilience in IoT-Enabled Systems: Addressing challenges related to cybersecurity, fault tolerance, and data integrity in smart systems.

I look forward to receiving your contributions.

Dr. Federico Fausto Santoro
Dr. Francesco Cauteruccio
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.