High Entropy Alloy Films

Dear Colleagues,

The concept of high entropy alloys (HEAs) was first proposed by Yeh et al. and Cantor et al. in 2004. Unlike the traditional alloys with one or rarely two base elements, HEAs contain at least five principal elements. Because of the synergy of high-entropy effects, severe lattice distortion, and sluggish diffusion, HEAs can form simple solid-solutions instead of intermetallic compounds. Extensive studies have been performed on various HEAs and many attractive properties have been achieved, such as high hardness and strength, high fatigue resistance, high corrosion resistance, high-temperature oxidation resistance, excellent biocompatibility, and enhanced irradiation resistance, etc., which have potential for structural and functional applications. At present, most of the HEAs have been fabricated by arc melting and casting. In recent years, a counterpart of the HEA, the HEA film (HEAF), has been developed. Different technologies have been adopted to fabricate HEAFs, including sputtering, electrodeposition, spraying, laser cladding, and plasma-transferred arc cladding, etc. Compared to HEAs, HEAFs experience a much faster cooling rate during the fabrication process which, in turn, would restrict the diffusion of elements and the formation of intermetallic compounds. As a result, HEAFs possess different structures and properties compared with their bulk counterparts. Experimental results have also shown the excellent mechanical and physical properties of HEAFs. This Special Issue, entitled “High Entropy Alloy Films” addresses the current understandings, new development, and challenges in a wide range of topics on HEAFs. The aim of this Special Issue is to provide a platform to bring together high-quality research and innovative ideas, and to bridge the gap between the fundamental research and applications for HEAFs. In particular, the topics of interest include, but are not limited to:

• Thin film technologies
• Composition design
• Structures and properties
• Hardening and strengthening
• Modeling
• Applications

Prof. Dr. Chun-Hway Hsueh
Guest Editor

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