2026 September - 14 articles
Flexible wearable biosensors have emerged as a promising technology for continuous, noninvasive health monitoring, driven by the growing demand for personalized healthcare and an aging global population. Polymeric substrates such as polyethylene tere...
We present a simulation-to-silicon security characterization of microarchitectural side channels on open-source RISC-V cores. Twenty-three attack classes are measured across a six-core corpus that spans the design space from simple in-order pipelines...
As smart sensing applications grow rapidly, the IoT edge architectures need to support low latency, make decisions with little memory, power, and communication resources while preserving the privacy of the data. But traditional cloud-based IoT soluti...
This article presents a finite impulse response (FIR) moving-average filter for validating noisy analog signals. While the conventional sliding-window implementation is computationally efficient, it requires storing the last N − 1 samples, lead...
As the need for the validation of mixed-signal systems such as Voice Coil Motor (VCM) drivers increases, verifying analog–digital interactions early in the design flow has become essential. Pure analog simulations are often too slow for system-...
Main memory carries data outside the processor’s trust boundary, so commodity systems-on-chip (SoCs) increasingly encrypt it; yet, in-line memory encryption engine itself becomes a differential power analysis (DPA) target whose key, if recovere...
Modern embedded systems are vulnerable to complex data-oriented attacks that subvert not only existing control-flow integrity protections but also have dire implications on safety-critical applications. To overcome this challenge, this work proposes...
Low-Density Parity-Check (LDPC) codes have traditionally performed better at longer code lengths. This research develops and rigorously evaluates a layered Quasi-Cyclic Low-Density Parity-Check (QC-LDPC) decoder architecture intended for Ultra-Reliab...
The interfacial adhesion strength of fine lines for flip-chip ball grid array (FCBGA) substrates is highly dependent on the surface desmear process during substrate manufacturing. However, the extremely narrow window for optimal desmear processes lim...
The transition from electrical to optical interconnects, enabled by the adoption of co-packaged optics (CPO) in advanced processors, is accelerating the scale-up to high volumes and redefining wafer-level test requirements. As optical interfaces migr...
This work presents a power-friendly framework for efficient manufacturing test of dynamic voltage and frequency scaling (DVFS)-based 3D Systems-on-Chip (SoCs). The proposed approach employs a through-silicon via (TSV)-based inter-layer test architect...
The growing deployment of Internet of Things (IoT) monitoring systems has resulted in demands for low-latency, secure, and energy-efficient intelligence on embedded chips. But most cloud-based and edge-assisted solutions are prone to high communicati...
The rapid adoption of Wide Band Gap (WBG) semiconductor technologies, particularly Silicon Carbide (SiC) and Gallium Nitride (GaN), together with emerging Ultra-Wide Band Gap (UWBG) materials such as AlGaN, Aluminum Nitride (AlN), Diamond, β-gal...
The growing demand for reliable wearable devices that can continuously monitor vital signs and track health under various conditions imposes challenging constraints on battery life. Wearable devices typically include a Photoplethysmogram (PPG) sensor...
