- Article
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
- Jin Zhao,
- Zuohuan Chen,
- Fei Qin and
- Daquan Yu
Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Ne...

