Metals

To give more insight into the microstructural evolution and deformation mechanisms governing the long-term service performance of additively manufactured TiAl-based composites at elevated temperatures, this study investigated the high-temperature compressive creep behavior of a laser powder bed-fused LaB₆ reinforced high-Nb TiAl-based composite after hot isostatically pressing (HIP), with emphasis on the creep response and dynamic recrystallization (DRX) mechanisms under different applied stress levels. The results showed that, as the applied stress increased from 200 MPa to 450 MPa, the steady-state creep rate rose from 2.88 × 10⁻⁸ s⁻¹ to 3.85 × 10⁻⁷ s⁻¹. Stress exponent analysis indicated that creep deformation was predominantly controlled by dislocation climb, and no tertiary creep stage was observed within the investigated stress range. At 200 MPa and 300 MPa, a certain fraction of recrystallized grains formed during prolonged creep exposure. When the stress increased to 400 MPa, the recrystallization process was restricted due to the limited creep duration. In contrast, at 450 MPa, the accelerated accumulation of strain energy significantly promoted recrystallization. Both continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) were identified, jointly governing the microstructural evolution. Superior creep resistance can be attributed to multiple synergistic strengthening mechanisms, including the refined α₂/γ lamellar structure induced by HIP treatment, the strong pinning effect of dispersed La₂O₃ nanoparticles on dislocation motion, and the suppression of diffusion-controlled dislocation climb by Nb addition. These combined effects enhance the high-temperature creep performance of the TiAl composite and provide important insights for the application of LPBF-fabricated TiAl-based composites under elevated-temperature service conditions.

The low-temperature toughness of a coarse-grained heat-affected zone (CGHAZ) is a critical factor governing the service safety of welded joints in X70 pipeline steel. This study systematically investigated the influence of nitrogen content (ranging from 0.0018 to 0.0120 wt%) on the microstructure and low-temperature impact toughness of the CGHAZ in X70 pipeline steel using welding thermal simulation tests with a heat input of 12.5 kJ/cm. The results indicate that the CGHAZ microstructure predominantly comprises lath bainite (LB) and minor martensite–austenite (M/A) constituents. With increasing nitrogen content, the austenite-to-ferrite transformation start temperature (Ar₃) increased while the transformation finish temperature (Ar₁) decreased, resulting in coarsening of the lath bainite packet structure. The M/A volume fraction rose from 2.11% to 5.23%, the average particle size grew from 0.17 to 0.71 μm, and the high-angle grain boundary (HAGB > 15°) fraction declined from 67.5% to 52.2%. These microstructural alterations collectively caused the Charpy impact energy of the CGHAZ to decrease from 269 J to 48 J. The deterioration in toughness is primarily attributed to blocky M-A constituents lowering the resistance to crack nucleation and the reduced HAGB fraction diminishing the resistance to crack propagation. This work provides a theoretical foundation for optimizing the performance of X70 pipeline steel welded joints, and it is recommended that the nitrogen content in the base metal be strictly maintained below 0.005 wt% to ensure superior CGHAZ toughness.

Controlling thermodynamic properties is critical for the rational design and development of advanced lead-free solders, especially in high-temperature applications. Au–Sn-based alloys have emerged as promising candidates for high-performance electronic packaging, yet reliable thermodynamic descriptions of their multicomponent systems remain limited. The Modified Molecular Interaction Volume Model (M-MIVM) provides a effective approach for characterizing strongly asymmetric liquid alloys that are typical in Au–Sn-based systems. This work focuses on the thermodynamic modeling of Au–Sn-containing ternary and quaternary solder systems within a physically consistent and computationally efficient framework. The study aims to support the database development, composition design, and optimization of next-generation high-temperature lead-free solders.