Design and Functional Performance in Optoelectronics and Advanced Electronic Packaging

Dear Colleagues,

The rapid advancement of artificial intelligence (AI), high-performance computing, optical communications, and heterogeneous integration technologies has driven unprecedented demands on the design and functional performance of optoelectronic devices and advanced electronic packaging systems. As semiconductor devices continue to scale and system complexity increases, challenges associated with material selection, thermal management, reliability, signal integrity, and manufacturing efficiency have become critical factors affecting overall performance. At the same time, emerging packaging technologies, novel functional materials, and photonic-electronic integration are opening new opportunities for next-generation electronic systems.

Recent progress in computational modeling, multiphysics simulation, and data-driven methodologies has further accelerated innovation in both optoelectronics and electronic packaging. Integrating AI and machine learning into design optimization, performance prediction, reliability assessment, and smart manufacturing has enabled more efficient development processes and improved system functionality. These advances are fostering interdisciplinary collaborations among materials scientists, mechanical engineers, electronics researchers, and manufacturing specialists, creating new pathways toward high-performance and sustainable technologies.

This Special Issue aims to present and disseminate the latest advances in the design, characterization, simulation, reliability assessment, and functional performance evaluation of optoelectronic devices and advanced electronic packaging technologies. We welcome original research articles and review papers addressing both fundamental studies and industrial applications. We particularly encourage contributions on innovative materials, advanced packaging architectures, numerical simulation, reliability engineering, artificial intelligence, machine learning, and intelligent manufacturing.

Topics of interest for publication include, but are not limited to, the following:

• Advanced electronic packaging and heterogeneous integration;
• 5D/3D packaging and chiplet technologies;
• Optoelectronic devices and photonic packaging;
• Electronic, photonic, and multifunctional materials;
• Thermal management and reliability assessment;
• Multiphysics modeling and simulation;
• Finite element analysis and design optimization;
• AI and machine learning for packaging and optoelectronics;
• Data-driven reliability prediction and digital twin technologies;
• Optical communication and silicon photonics;
• Sustainable materials and green packaging technologies.

Prof. Dr. Kuo-Ning Chiang
Guest Editor

Manuscript Submission Information

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