Advances in Light Alloys and Related Composites

Dear Colleagues,

High-performance light alloys and composite (HPLAC) materials have attractive attention for decades, since they possess a promising future for application in industry, transportation and aerospace. Extensive novel preparation methods, specific heat-treatment strategies, particular alloying elements and reinforcements have been confirmed to efficiently improve the mechanical properties of HPLAC materials. Nowadays, the development of advanced testing and inspection equipment and precise computational material theories have provided new opportunities for designing and producing HPLAC materials.

This Special Issue will provide readers with up-to-date information on the recent progress in the field of HPLAC materials. Papers related to preparation methods, microstructure characterization, mechanical properties, and the service performance of HPLAC materials are all within the realm of this Special Issue. Potential material preparation methods include, but are not limited to, casting, powder metallurgy, and 3D printing, while the mechanical properties for consideration include tensile strength, yield strength, ductility, fatigue performance, elastic modulus and wear resistance, etc., at both room temperature and elevated temperature.

It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews that address advances in HPLAC materials are welcome.

Dr. Tong Gao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.