Advancements in Thin Film Deposition Technologies—Second Edition
This special issue belongs to the section "Thin Films and Interfaces".
Special Issue Information
Dear Colleagues,
Following the success of the first edition, I am pleased to announce the launch of the Second Edition of the Special Issue "Advancements in Thin Film Deposition Technologies".
Thin film technology remains a cornerstone of modern materials science, acting as a critical enabler for next-generation devices in electronics, energy harvesting, optics, and biomedical applications. As measurement techniques evolve and device dimensions shrink, the demand for precise, scalable, and novel deposition methodologies continues to grow.
This Special Issue aims to collect the latest breakthroughs in thin film deposition, covering both physical (PVD) and chemical (CVD, ALD) vapor deposition techniques, as well as solution-based processing. We are particularly interested in manuscripts that address current challenges such as conformality on complex 3D structures, low-temperature processing, interface engineering, and the synthesis of metastable or nanostructured phases.
We invite researchers to contribute full research articles, short communications, and comprehensive reviews. Studies focusing on the correlation between deposition parameters, microstructure evolution, and functional properties (electrical, optical, mechanical, or magnetic) are highly encouraged.
I look forward to receiving your contributions and continuing the high-standard discussion started with the first edition.
Dr. Nicola Calisi
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- physical vapor deposition (PVD)/sputtering
- chemical vapor deposition (CVD)/ALD
- epitaxial growth
- thin film characterization
- interface engineering
- nanostructured films
- coating technologies
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