Special Issue "Selected Material Related Papers from ICI2016"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 August 2017).
Interests: nano manufacturing; solar cells and optoelectronic sensing element; molecular dynamics
Interests: high precision instrument design; laser engineering; smart sensors and actuators; optical device; optical measurement; metrology
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Special Issue in Inventions: Innovation and Inventions of Electro-Optical Materials and Devices and their Application
Special Issue in Applied Sciences: Selected Papers from the 2016 International Conference on Inventions
Topical Collection in Inventions: Feature Innovation Papers
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Topical Collection in Inventions: Patent Summary
Special Issue in Sensors: I3S 2018 Selected Papers
Special Issue in Applied Sciences: Patent Based and Extended Research in Industry 4.0
Special Issue in Applied Sciences: 2019 Smart Manufacturing on Production System, Quality Assurance, Process optimization, and Digital Modeling
Special Issue in Sensors: Selected Papers about Sensor Application from 16th International Conference on Automation Technology
Interests: heat transfer; nanocatalysis; energy conversion; advanced manufacturing
Special Issues and Collections in MDPI journals
Interests: metal material; nanomaterial; composite; amorphous materials; TEM microstructural analysis; fracture mechanic; dynamic material property
The aims and scope of the 2016 International Conference on Inventions is to make researchers focus on patent-based research. This Special Issue will also focus on inventions in materials engineering. Material-related invention is a solution to a specific technological problem and is an improvement on new processes, new materials, and new components, which also could achieve a completely unique function or radical breakthrough. However, there is a very thin line between brilliant innovation and absolute failure, as some of these inventors famously discovered, and also may even face the problems of insufficient funds. Therefore, patent-based research is a form that offers a way to apprehend the ideas and advance projects immediately and rapidly by the successful, practical results of predecessors. We expect the conference to be a platform for successful patent inventors to share their experiences in inventing with all the participants of the conference. At the same time, the conference also aims to gather and show high quality papers concerning the discovery of completely unique functions or results, while even going further in order to advance the frontiers of science and extend the standards of excellence established by inventions to readers.
Topics of the conference include:
- Patent-based inventions in materials engineering
- Inventions in device materials and sensors materials
- Inventions in processes for materials
- Inventions in biotechnology and materials
Prof. Dr. Te-Hua Fang
Prof. Dr. Chien-Hung Liu
Dr. Ming-Tsang Lee
Dr. Tao-Hsing Chen
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- patent-based inventions in materials engineering
- device materials
- sensor materials
- biotechnology materials
- thin film materials