Recent Advances in Electromagnetic Interference Shielding Materials

Dear Colleagues,

The rapid development of electronics, including wireless communication systems, medical devices, and military equipment, has made the science of electromagnetic radiation and the pollution it creates, known as electromagnetic interference (EMI), of utmost consideration in modern technologies. These concerns have attracted extensive research on the fabrication of numerous shielding materials, utilizing various carbon allotropes, metal nanowires, polymers, and very recently MXene composites. Interestingly, while research on the new fabrication techniques of EMI shields with higher shielding effectiveness is still in progress, current studies have drifted toward the fabrication of lightweight and multilayer EMI shielding materials with improved mechanical characteristics for more unconventional flexible electronics. As the next big leap in the field of electromagnetic shielding materials, it is important to bring together novel high-quality ideas to cover the type of materials, underlying shielding mechanisms, and fabrication techniques employed. Highlighting the merits, drawbacks, challenges, and industry demands for different shielding applications can significantly support progress in this field. 

Hence, the objective of this Special Issue is to offer a platform for the latest innovative EMI shielding material fabrication technologies within the scope of the journal to provide an outlook for future trends in the growing interest of the industry in this area.

We kindly invite you to submit an article/review for this Special Issue. Full papers, communications, and reviews are all welcome.

Dr. Ehsan Hosseini
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.