Meet Us at the 9th International Conference on Electronics Technology (ICET 2026), 29–31 May 2026, Chengdu, China

MDPI will be attending the 9th International Conference on Electronics Technology (ICET 2026), which will be held in Chengdu, China, from 29 to 31 May 2026.

ICET 2026 is co-sponsored by the IEEE Chengdu Section and the Sichuan Institute of Electronics, and is hosted by the Youth Talent Work Committee of Sichuan Institute of Electronics, with the support of the University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc.

ICET conference's core objective is to establish an academic forum for scientists worldwide, both senior and emerging, to share research insights, knowledge, and advancements in electronics, micro/nanoelectronics, and electronic packaging. The conference also connects university academics, industry professionals, and the technical community, fostering collaboration and knowledge exchange on the latest technological advancements.

The following open access journals will be represented at the conference:

• Technologies;
• Electronics;
• Information;
• IoT;
• JLPEA;
• Microwave;
• Telecom;
• Electricity;
• Hardware;
• JETA;
• JSAN;
• Chips;
• WEVJ.

If you are planning to attend the above conference, please feel free to stop by our booth. Our delegates look forward to meeting you in person and answering any questions that you may have.

For more information about this conference, please visit the following website: https://icet.net/index.html.