Implantable Sensors for Neuroengineering
This special issue belongs to the section "Biomedical Engineering and Biomaterials".
Special Issue Information
Dear Colleagues,
Implantable sensors constitute a foundational technology in neuroengineering, supporting neural recording, stimulation, and closed-loop neuromodulation for both research and clinical applications. From deep-brain implants to spinal implants, advances in miniaturization, soft and biocompatible materials, and multifunctional integration have substantially expanded the capabilities and application scope of implantable neural sensing systems, encompassing both long-term devices and short-term biodegradable implants.
As these implantable neural sensing technologies continue to evolve toward greater levels of integration and autonomy, the increasing adoption of fully implantable systems introduces new challenges for implantable sensors and wireless modules operating in complex biological environments. Key issues include, but are not limited to, device miniaturization, material compatibility, sensing reliability, and the robustness and bandwidth of wireless links across diverse implantation sites and application scenarios.
In this context, this joint Special Issue of the Sensors and Bioengineering journals on “Implantable Sensors for Neuroengineering” aims to highlight recent advances in implantable sensors, wireless technologies, and system-level solutions for neuroengineering. We welcome original research articles, reviews, and perspectives that address fundamental principles, emerging technologies, and translational challenges in implantable neural sensing.
You may choose our Joint Special Issue in Sensors.
Dr. Mingxiang Gao
Dr. Pietro Siciliano
Guest Editors
Dr. Fariba Karimi
Guest Editor Assistant
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Bioengineering is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- implantable sensors
- wireless bioelectronics
- implantable antennas
- flexible bioelectronics
- neuroengineering
- neural interfaces
- brain–computer interface
- neuromodulation
- neural prosthetics
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