- Perspective
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips
- Xunyu Li,
- Zijin Pan,
- Weiquan Hao,
- Runyu Miao,
- Zijian Yue and
- Albert Wang
The ending of Moore’s Law calls for innovations in integrated circuit (IC) technologies and chip designs. Heterogeneous integration (HI) emerges as a pathway towards smart future chips for more Moore time and for beyond-Moore time, featuring sy...

