Mechanical Behavior of Advanced Engineering Materials (Third Edition)

Dear Colleagues,

In recent years, we have witnessed significant advances in the domain of advanced engineering materials (AEMs), such as light-weight and high-strength metals and alloys, intermetallics, composites, shape-memory alloys, and metallic glasses. These materials have been employed in the automotive, aerospace and astronautics, electronics, medical device, and sport industries. The mechanical properties of materials, including their elastoplasticity, anisotropy, formability, fracture mechanics, defect interactions, and strengthening and toughness mechanisms, play a critical role in their manufacturing/forming operations and in-service performance. Understanding the mechanical behavior of AEMs is mandatory for the effective usage of these materials; this prompts the vigorous development of cutting-edge experimental techniques for multiscale mechanical tests and microstructural characterizations, as well as state-of-the-art computational and theoretical methods with advanced constitutive models. This Special Issue, entitled “The Mechanical Behaviors of Advanced Engineering Materials”, aims to present high-quality original research articles regarding the mechanical properties of AEMs. The topics addressed will be of major interest to scientists and professionals working at universities, research institutes, laboratories and industries concerned with the design, optimization, and application of AEMs.

The scope of this Special Issue includes, but is not limited to, the following topics:

• Theoretical and fundamental insights into the microstructure–property relationships of AEMs: metals and alloys, composites, intermetallics, shape-memory alloys, metallic glasses, etc.
• Novel and multiscale computational methods for the prediction, analysis, and design of the mechanical properties and forming/manufacturing processes of AEMs, including advanced and enriched constitutive models, multiscale modeling methods, computational damage, and fracture mechanics.
• Understanding of the forming/manufacturing processes, deformation mechanisms, and mechanical responses and failure of AEMs, connecting between these processes and their underlying physical mechanisms of plasticity, damage, fracture, and interaction among defects.
• Advanced experimental and characterization methods to reveal the ternary relationships among the microstructure, process, and mechanical behaviors of materials, such as developing novel experimental devices and techniques, full-field measurements across different length scales, and ex situ and in situ mechanical tests integrated with various microscopic visualization methods.
• Mechanics-based investigations on emerging areas such as 3D printing, additive manufacturing, and intelligent manufacturing of AEMs.

It is our pleasure to invite you to submit a manuscript to this Special Issue. Full papers, communications, and reviews are welcome.

Prof. Dr. Zhubin He
Dr. Kelin Chen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.