A W-band, high-gain, hybrid slot antenna array based on bulk silicon MEMS technology is proposed in this paper. The high-order-mode cavity is explored to excite the 2 × 2-slot basic unit, so as to reach the low-profile requirement of the bulk s...
A 16-pixel terahertz (THz) receiver front-end working at room temperature was designed, built, and measured in this paper. The designed receiver front-end is based on the antenna-coupled AlGaN/GaN high-electron-mobility transistor (HEMT) THz linear d...
Acceleration sensitivity in silicon bulk-extensional mode oscillators is studied in this work, and a correlation between the resonator alignment to different crystalline planes of silicon and the observed acceleration sensitivity is established. It i...
For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectrome...
This paper demonstrates a novel micro-size (120 μm × 200 μm) piezoelectric gas sensor based on a piezotransduced single-crystal silicon bulk acoustic resonator (PSBAR). The PSBARs operate at 102 MHz and possess high Q values (about 2000), ensuring th...
Using bulk micromachining, meander-shaped resistor elements consisting of 20 nm Cr and 200 nm Au were fabricated on 1 µm thick silicon nitride membranes, bridges, and cantilevers. The resistance change as a function of pressure depends strongly on th...
We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduce...
Compared with conventional solid-state relays, micro-electro mechanical system (MEMS) relays have the advantages of high isolation, low contact resistance, low power consumption, and abrupt switching characteristics. Nevertheless, the widespread appl...
In this paper, a simple fabrication process for SU-8 in-plane micro electro-mechanical systems (MEMS) structures, called “border-bulk micromachining”, is introduced. It aims to enhance the potential of SU-8 MEMS structures for application...
In this study, a ZnO nanorods (NRs) patterned MEMS piezoresistive silicon micro-cantilever was fabricated as environmental monitor. The fabrication starts from bulk silicon, utilizing photolithography, diffusion, inductively coupled plasma (ICP) cryo...
This paper proposes a novel high-sensitivity micro-electromechanical system (MEMS) piezoresistive pressure sensor that can be used for rock mass stress monitoring. The entire sensor consists of a cross, dual-cavity, and all-silicon bulk-type (CCSB) s...
Micromachined devices were developed and fabricated using complementary metal-oxide-semiconductor (CMOS)/micro-electro-mechanical systems (MEMS) technology allowing for the analysis of transport properties of silicon sub-micron beams having monolithi...
Heavily boron-doped silicon layers and boron etch-stop techniques have been widely used in the fabrication of microelectromechanical systems (MEMS). This paper provides an introduction to the fabrication process of nanoscale silicon thermoelectric de...
Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medica...
A resonant microbeam accelerometer of a novel highly symmetric structure based on MEMS bulk-silicon technology is proposed and some numerical modeling results for this scheme are presented. The accelerometer consists of two proof masses, four support...
This article reviews the applications of silicone resins as ceramic precursors. The historical background of silicone synthesis chemistry is introduced to explain the production costs and supply availability of various silicones. Thermal degradation...
This paper presents the development and measurement results of a complementary metal oxide semiconductor (CMOS) readout application-specific integrated circuit (ASIC) for bulk-silicon microelectromechanical system (MEMS) accelerometers. The proposed...
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresis...
Microstructure curvature, or buckling, is observed in the micromachining of silicon sensors because of the doping of impurities for realizing certain electrical and mechanical processes. This behavior can be a key source of error in inertial sensors....
The desideratum to develop a fully integrated Lab-on-a-chip device capable ofrapid specimen detection for high throughput in-situ biomedical diagnoses and Point-of-Care testing applications has called for the integration of some of the novel technolo...
This study addresses the need for a mechanical property characterization of films during Micro-Electro-Mechanical System (MEMS) processing by proposing a novel in situ on-wafer tensile strength testing method for film materials. This method integrate...
In this study, an electrostatic force-driven on-chip tester consisting of a mass with four guided cantilever beams was employed to extract the process-related bending stiffness and piezoresistive coefficient in-situ for the first time. The tester was...
This paper presents an alternative approach for angular-rate sensing based on the way that the natural vestibular semicircular canals operate, whereby the inertial mass of a fluid is used to deform a sensing structure upon rotation. The presented gyr...
The substrate plays a key role in chemoresistive gas sensors. It acts as mechanical support for the sensing material, hosts the heating element and, also, aids the sensing material in signal transduction. In recent years, a significant improvement in...
In this paper, we present a redundant microsensor based on the bulk and etch silicon‑on‑insulator (BESOI) process for measuring relative humidity (RH), by using a graphene‑oxide/polyvinyl‑alcohol (GO/PVA) composite. The MEMS is a mechanical oscillato...
Sensing systems are becoming less and less invasive. In this context, flexible materials offer new opportunities that are impossible to achieve with bulky and rigid chips. Standard silicon sensors cannot be adapted to curved shapes and are susceptibl...
A novel lateral dual-axis a-Si/SiO2 waveguide Bragg grating based quad-beam accelerometer with high-resolution and large linear range has been presented in this paper. The sensor consists of silicon bulk micromachined proof mass suspended by silica b...
Mastering non-evaporable getter (NEG) thin films by elucidating their activation mechanisms and predicting their sorption performances will contribute to facilitating their integration into micro-electro-mechanical systems (MEMS). For this aim, thin...