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Open AccessArticle

A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

1
Department of Electrical and Computer Engineering, McGill University, McConnell Engineering Building, 3480 University Street, Montreal, QC H3A 0E9, Canada
2
CMC Microsystems, 945 Princess Street, Building 50, Innovation Park at Queen's University, Kingston, ON K7L 3N6, Canada
*
Author to whom correspondence should be addressed.
Academic Editor: Stefano Mariani
Sensors 2015, 15(4), 7349-7359; https://doi.org/10.3390/s150407349
Received: 23 January 2015 / Revised: 2 March 2015 / Accepted: 10 March 2015 / Published: 25 March 2015
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at 10 milliTorr which provides a high Quality factor and reduces noise interference on the MEMS sensor devices. The MIDIS process is based on high aspect ratio bulk micromachining of single-crystal silicon layer that is vacuum encapsulated between two other silicon handle wafers. The process includes sealed Through Silicon Vias (TSVs) for compact design and flip-chip integration with signal processing circuits. The proposed accelerometer design is sensitive to single-axis in-plane acceleration and uses a differential capacitance measurement. Over ±1 g measurement range, the measured sensitivity was 1fF/g. The accelerometer system was designed to provide a detection resolution of 33 milli-g over the operational range of ±100 g. View Full-Text
Keywords: MEMS accelerometer; capacitive sensor; commercial MEMS process; low noise sensor; wafer-level vacuum encapsulation; Teledyne DALSA MIDIS process; inertial sensor MEMS accelerometer; capacitive sensor; commercial MEMS process; low noise sensor; wafer-level vacuum encapsulation; Teledyne DALSA MIDIS process; inertial sensor
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MDPI and ACS Style

Merdassi, A.; Yang, P.; Chodavarapu, V.P. A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process. Sensors 2015, 15, 7349-7359. https://doi.org/10.3390/s150407349

AMA Style

Merdassi A, Yang P, Chodavarapu VP. A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process. Sensors. 2015; 15(4):7349-7359. https://doi.org/10.3390/s150407349

Chicago/Turabian Style

Merdassi, Adel; Yang, Peng; Chodavarapu, Vamsy P. 2015. "A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process" Sensors 15, no. 4: 7349-7359. https://doi.org/10.3390/s150407349

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