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Open AccessArticle

A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

by Junjie Wu 1,2, Lihua Lei 2, Xin Chen 1,*, Xiaoyu Cai 2, Yuan Li 2 and Tao Han 1
1
School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, No. 800, Dongchuan Road, Shanghai 200240, China
2
Shanghai Institute of Measurement and Testing Technology, National Center of Measurement and Testing for East China, National Center of Testing Technology, No. 1500, Zhangheng Road, Shanghai 201203, China
*
Author to whom correspondence should be addressed.
Sensors 2014, 14(11), 20533-20542; https://doi.org/10.3390/s141120533
Received: 28 August 2014 / Revised: 21 October 2014 / Accepted: 22 October 2014 / Published: 30 October 2014
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it was validated using the finite element method. A precise data acquisition circuit with an accuracy of 20 μV was designed to obtain weak voltage signals. By calibration, the sensing system was shown to have a sensitivity of 17.29 mV/μm and 4.59 mV/μm in the axial and lateral directions, respectively; the nonlinearity in these directions was 0.8% and 1.0% full scale, respectively. A full range of 4.6 μm was achieved in the axial direction. Results of a resolution test indicated that the sensing system had a resolution of 5 nm in the axial direction and 10 nm in the lateral direction. View Full-Text
Keywords: dimensional metrology; piezoresistor; MEMS; microtactile sensor dimensional metrology; piezoresistor; MEMS; microtactile sensor
MDPI and ACS Style

Wu, J.; Lei, L.; Chen, X.; Cai, X.; Li, Y.; Han, T. A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors 2014, 14, 20533-20542.

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