Design of High-Entropy Alloys

Dear Colleagues,

High entropy alloys (HEAs) and related complex, concentrated alloys (CCAs) have resulted from new approaches to alloy design, which emerged 16 years ago. These approaches change the established paradigm of alloy development when small amounts of alloying elements add to a single principle element. Instead, HEAs/CCAs suggest the usage of multiple (at least 3–5) principle elements taken in close to equiatomic proportions with the possible presence of minor components. Due to such a complex chemical composition, the alloys can have unique structures and properties, not readily available in conventional alloys. For example, some HEAs/CCAs demonstrate remarkable strength at elevated temperatures, which makes them promising candidates for Ni-based superalloy replacement, or an unprecedented combination of strength, ductility, and toughness at cryogenic conditions. HEAs/CCAs are often considered as promising structural materials; however, they can also offer interesting functional properties. Moreover, in addition to alloys, high entropy ceramics and coatings have recently emerged and already demonstrated remarkable properties.

With the above-mentioned scope of the field, the new Special Issue on the Design of High Entropy Alloys welcomes submissions on a variety of different topics. Works on fundamental aspects like phase formation and transformations, strengthening and deformation mechanisms, as well as diffusion are welcome equally with more application-driven research focused on properties. Both theoretical and experimental contributions are welcome; works that will combine both approaches are especially appreciated. Investigations of functional properties of HEAs and non-metallic high-entropy materials are also eagerly anticipated. We hope that the paper published in the Special Issue will advance our understanding of composition–structure–properties relationships in HEAs and related materials and contribute to the design of new materials with unprecedented properties for future applications.

Prof. Dr. Sergey V. Zherebtsov
Dr. Nikita Stepanov
Guest Editors

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