- Article
Design for the Package-Board Transition and Its Testability Design in the Fan-Out Wafer-Level Package
- Ying Chen,
- Jun Li and
- Liqiang Cao
A fan-out wafer level package (FOWLP) with double-sided four redistribution layers (RDLs) and the mega pillars connecting the front and back RDLs has been proposed for millimeter-wave applications. A well-matched package-board transition has been des...

