Micromachines, Volume 11, Issue 6
2020 June - 87 articles
Cover Story: In this study, an alternative fan-out wafer-level packaging (FOWLP) concept implementing additively manufactured redistribution layers (RDLs) for capacitive micromachined ultrasound transducer (CMUT) array packaging was proposed. The printed RDLs served as an interconnect between capacitive microphones and speakers, operating in the ultrasonic domain, with corresponding application-specific integrated circuits (ASICs), which allow features such as touchless activation or control using gestures. View this paper
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Micromachines - ISSN 2072-666X