Flexible Sensors and Wearable Electronics

Dear Colleagues,

This Special Issue presents recent advances in wearable electronics for human health monitoring and embodied intelligent robotics, with a focus on flexible pressure sensors, flexible strain sensors, electronic skin, and flexible electronics. Gel-based flexible platforms offer intrinsic softness, stretchability, and biocompatibility, providing an ideal foundation for constructing highly deformable and skin-conformable sensing devices with piezoresistive, capacitive, piezoelectric, and ionotronic response mechanisms.

In the domain of human health monitoring, the contributions cover wearable devices that measure physiological parameters such as joint motion, heart rate, respiration, and arterial blood pressure waveforms. The integration of deep-learning-assisted signal processing enables real-time disease diagnosis, personalized healthcare tracking, and prevention of conditions such as pressure injuries, venous leg ulcers, and nerve injuries. Emerging research further focuses on multifunctional integration and sustainable materials to address traditional limitations in mechanical strength and long-term stability.

For embodied intelligent skin in robotics, this issue explores e-skin technologies that provide robots with human-like tactile sensitivity, enabling the detection of pressure, temperature, and surface texture. Edge-intelligent bimodal skins that integrate large‑area coverage with low-latency signal acquisition and lightweight deep learning frameworks enable real-time autonomous decision-making directly on the device, facilitating smooth, adaptive human–robot interaction and collaborative task execution in complex environments. This Special Issue thus bridges cutting-edge materials, sensor engineering, and intelligent computing to advance next‑generation wearable systems.

Dr. Weiqiang Hong
Dr. Xiaohui Guo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.