Advances in Integrated Flexible Electronic Sensors

Dear Colleagues,

The innovation and integration of flexible electronic sensors have emerged as a vibrant and globally pivotal research field owing to their unique mechanical flexibility, lightweight characteristics, and excellent conformability. Despite tremendous breakthroughs in material preparation, structural design and prototype fabrication, current flexible electronic sensors still confront prominent bottlenecks including poor integration compatibility, insufficient mechanical durability under repeated deformation, signal drift under complex strain conditions, limited multi-parameter synchronous detection capability, and unsatisfactory large-area conformal fitting performance for curved and dynamic surfaces.

In this Special Issue, we invite the submission of original research articles and comprehensive review articles covering all frontier aspects of integrated flexible electronic sensors and their engineering applications. Topics of interest include, but are not limited to, flexible conductive and sensing functional materials, stretchable electrode and circuit integration technology, multi-functional flexible sensor arrays, wearable and implantable flexible sensing devices, intelligent flexible sensing systems with signal processing and data analysis functions, and key technologies for flexible intelligent skin such as large-area integrated sensing skin, bionic tactile perception skin, multi-physical field collaborative sensing skin, and adaptive intelligent skin for robotic and aerospace applications. We also welcome high-quality contributions focusing on structural optimization, performance enhancement, system integration, and practical application verification of advanced integrated flexible electronic sensors and flexible intelligent skin systems in biomedical engineering, smart wearable devices, intelligent robotics, aerospace intelligent perception, and smart equipment fields.

Dr. Zhiqiang Ma
Dr. Dawei Shen
Dr. Weibin Zhu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.