Electronics, Volume 11, Issue 22
2022 November-2 - 196 articles
Cover Story: Electrically conductive paths and elements in 3D-printed electronics are usually prepared from polymer composites with carbon or metal additives or silver pastes. Here, we propose a new approach to implement fusible alloys for fabricating conductive paths inside 3D-printed polymer structures and mounting electronic components using Fused Deposition Modeling for metals (FDMm). A comparison of solder wires is discussed to determine whether the solder alloys exhibit adequate wettability and adhesion to the polymer substrate. The symmetrical astable multivibrator circuit based on bipolar junction transistors (BJT) was fabricated with the FDMm technique. Additional perspectives for applying this technique to 3D-printed structural electronic circuits are also discussed. View this paper - Issues are regarded as officially published after their release is announced to the table of contents alert mailing list .
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