- Communication
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
- Takashi Matsumae,
- Shingo Kariya,
- Yuichi Kurashima,
- Le Hac Huong Thu,
- Eiji Higurashi,
- Masanori Hayase and
- Hideki Takagi
This study demonstrates room-temperature bonding using a getter layer for the vacuum packaging of microsystems. A thick Ti layer covered with an Au layer is utilized as a getter layer because it can absorb gas molecules in the package. Additionally,...