The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition...
Electroplating has become a cornerstone technology in semiconductor manufacturing, enabling high-performance interconnects and advanced packaging. Since the introduction of the Damascene Cu process at the 180 nm node, it has evolved to meet the deman...
Porous templates are widely used for the preparation of various metallic nanostructures. Semiconductor templates have the advantage of controlled electrical conductivity. Site-selective deposition of noble metal formations, such as Pt and Au nanodots...
Photovoltaic (PV) technology is rapidly entering the energy market, providing clean energy for sustainable development in society, reducing air pollution. In order to accelerate the use of PV solar energy, both an improvement in conversion efficiency...
Electroplating has been favored to date as a surface treatment technology in various industries in the development of semiconductors, automobiles, ships, and steel due to its advantages of being a simple, solution-based process, with low cost and hig...
The most promising approach for improving the electrical performance of connectors used in semiconductor test sockets involves increasing their electrical conductivity by incorporating one-dimensional (1D) conductive materials between zero-dimensiona...
Narrow band-gap semiconductors, namely ternary InAsSb alloys, find substantial technological importance for mid-infrared application as photodetectors in medical diagnostics or environmental monitoring. Thus, it is crucial to develop electrical conta...
As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters and higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within in...
Three-dimensional integrated packaging with through-silicon vias (TSV) can meet the requirements of high-speed computation, high-density storage, low power consumption, and compactness. However, higher power density increases heat dissipation problem...
Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Al...
Increasing requirements for neural implantation are helping to expand our understanding of nervous systems and generate new developmental approaches. It is thanks to advanced semiconductor technologies that we can achieve the high-density complementa...
Electrodeposition of cadmium telluride (CdTe) on fluorine doped tin oxide (FTO) using two electrode configurations was successfully achieved with the main focus on the growth temperature. The electroplating temperatures explored ranged between 55 and...
For the analysis of thin films, with high aspect ratio (HAR) structures, time-of-flight secondary ion mass spectrometry (ToF-SIMS) overcomes several challenges in comparison to other frequently used techniques such as electron microscopy. The researc...
Ozonation and ozone-based advanced oxidation processes, including ozone/hydrogen peroxide and ozone/ultraviolet irradiation, have been extensively studied for their efficacy in treating wastewater across various industries. While sectors such as pulp...
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a m...
The IC lead frame is an essential component in semiconductor packaging, primarily composed of a nickel (Ni)–copper (Cu) alloy in which Ni is electroplated onto a Cu substrate. In this study, synergistic solvent extraction using a binary extract...