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Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Electronic Materials and Sensors Group, Materials and Engineering Research Institute, Sheffield Hallam University, Sheffield S1 1WB, UK
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Coatings 2018, 8(8), 262; https://doi.org/10.3390/coatings8080262
Received: 26 June 2018 / Revised: 15 July 2018 / Accepted: 25 July 2018 / Published: 27 July 2018
(This article belongs to the Special Issue Advanced Thin Film Materials for Photovoltaic Applications)
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Abstract

The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, ultraviolet-visible spectroscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, and photoelectrochemical cell studies. Based on the results of structural, morphological, compositional, optical, and electronic properties evaluated, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable for producing excellent devices. In this paper we will describe the progress of electroplating techniques mainly for the deposition of semiconductor thin film materials and their treatment processes, and fabrication of solar cells. View Full-Text
Keywords: electroplating; semiconductors; large-area electronics; characterisation; solar cells electroplating; semiconductors; large-area electronics; characterisation; solar cells
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Ojo, A.A.; Dharmadasa, I.M. Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review. Coatings 2018, 8, 262.

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