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Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process. The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue policies and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.

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Fiber Optic Sensors: From Materials to Applications

edited by

Chuen-Lin Tien

submission deadline 20 Jul 2026 | Viewed by 90 | Submission Open

Keywords: materials for fiber optic sensors; fiber Bragg grating; fiber sensor; flexible sensor; LMR/SPR sensor; optical sensor

(This special issue belongs to the Section A：Physics)

Advances in Nano/Micro Engineered & Molecular Systems

edited by Xiaosheng Zhang, Haitao Zhao,

Cao Xia

and

Cheng Tu

submission deadline 25 Jul 2026 | Viewed by 84 | Submission Open

Keywords: micro/nano electro-mechanical systems(M/NEMS); micro/nano/molecular fabrication; micro/nano robotics; micro/nano/molecular physical/chemical sensors/actuators; nano photonics and micro/molecular optical devices; micro/nano-composite materials and structures; micro/nano-bio-/medical devices and systems; functional nanomaterials and synthesis; micro/nano integrated devices/circuits/systems

Microelectronics Assembly and Packaging: Materials and Technologies, 3rd Edition

edited by

Liangxing Hu

and Peng Zhao

submission deadline 30 Jul 2026 | Viewed by 336 | Submission Open

Keywords: semiconductor packaging; advanced pakaging; chip and wire bonding technology; mixed-assembly technology; multichip modules (MCM); package-on-package (PoP); system-in-package (SiP); heterogeneous integration; chiplet interconnection; hybrid bonding; 2.5D (interposer); 3D (TSV/TGV); packaging materials; materials qualification

(This special issue belongs to the Section E：Engineering and Technology)

Novel Micromechanical Resonators, Filters, and MEMS/NEMS Transducers

edited by

Jing Wang

, Nelson Sepúlveda,

Philip Feng

and Guoan Wang

submission deadline 30 Jul 2026 | Viewed by 133 | Submission Open

Keywords: RF MEMS; micromechanical resonators; filters; oscillators; resonant sensors; MEMS resonator readout circuits

(This special issue belongs to the Section A：Physics)

Advanced Applications in Microrobots, 2nd Edition

edited by

Xinjian Fan

submission deadline 30 Jul 2026 | Viewed by 66 | Submission Open

Keywords: magnetic microrobots; micro-scale robotics; biomimetic robotics; microfluidics; microassembly; targeted drug delivery; micro-manipulation; soft robotics

(This special issue belongs to the Section A：Physics)

Microfluidics in Biomedical Research

edited by

Nan Xiang

submission deadline 31 Jul 2026 | 1 articles | Viewed by 2184 | Submission Open

Keywords: microfluidics; artificial intelligence; point-of-care testing devices or instruments; biomedical research; emerging techniques

(This special issue belongs to the Section B：Biology and Biomedicine)

Piezoelectric Sensors, Actuators, Transducers, and Energy Harvesters

edited by

Lin Zhang

, Wenjuan Liu and

Dabin Lin

submission deadline 31 Jul 2026 | Viewed by 129 | Submission Open

Keywords: piezoelectric materials; MEMS; flexible sensors; transducers

(This special issue belongs to the Section A：Physics)

Recent Advancements in Micromachined Ultrasonic Transducers

edited by

Zhikang Li

and Jie Li

submission deadline 31 Jul 2026 | Viewed by 117 | Submission Open

Keywords: micromachined ultrasonic transducers (MUTs); PMUTs; CMUTs; low-power consumption; high performance; micro- and nano-manufacturing; applications of MUTs

(This special issue belongs to the Section A：Physics)

Acoustic Microfluidics: Design, Fabrication, and Applications

edited by

Jin-Chen Hsu

and

Jia-Hong Sun

submission deadline 31 Jul 2026 | Viewed by 92 | Submission Open

Keywords: acoustofluidics; microfluidics; bulk acoustic wave; surface acoustic wave; acoustic streaming; acoustic radiation force

(This special issue belongs to the Section A：Physics)

Photonic and Optoelectronic Devices and Systems, 4th Edition

edited by

Muhammad Ali Butt

submission deadline 31 Jul 2026 | Viewed by 65 | Submission Open

Keywords: optical waveguide devices; photonic sensors; photodiodes; solar cells; lasers; optical switches; logic gates; light-emitting diodes; plasmonics; metamaterials; photonic crystals; wearables; non-linear photonics; photonics for AI and neuromorphic computing; qauntum photonics

(This special issue belongs to the Section A：Physics)

Emerging Trends in Optoelectronic Device Engineering, 2nd Edition

edited by Indu Sharma and Vasudeva Reddy Minnam Reddy

submission deadline 31 Jul 2026 | Viewed by 63 | Submission Open

Keywords: optoelectronics; 2D materials; thin films; semiconducting materials; quantum dots; photoluminescence; bandgap engineering; photovoltaics; optical sensors; light emitting diodes (LEDs); solar cells; photodetectors; photoelectrochemical; water splitting

Integrated Photonics and Optoelectronics, 3rd Edition

edited by

He Yang

submission deadline 31 Jul 2026 | Viewed by 26 | Submission Open

Keywords: active and passive photonic devices ; nanoscale optical modulators and photodetectors ; chip-integrated single-photon generation and detection ; photonic interfaced hybrid quantum system ; photonic computing and photonic quantum computing ; advanced nanomaterial for photonic structure ; on-chip mid-IR photonics ; micro- and nanofabrication techniques

(This special issue belongs to the Section A：Physics)

RF and Power Electronic Devices and Applications, 2nd Edition

edited by

Hao Lu

and Yuqi Wei

submission deadline 31 Jul 2026 | Viewed by 23 | Submission Open

Keywords: gallium nitride HEMT; power electronics; RF and mmWave device; power converter

(This special issue belongs to the Section D：Materials and Processing)

Micro Sensors and Devices for Ocean Engineering

edited by Chenyang Xue

submission deadline 31 Jul 2026 | Viewed by 12 | Submission Open

Keywords: advanced ocean sensing; marine microsensors; micro-nano fabrication

(This special issue belongs to the Section A：Physics)

Next-Generation Piezoelectric Films: Materials, Fabrication, and Applications

edited by Longfei Song

submission deadline 31 Jul 2026 | Viewed by 12 | Submission Open

Keywords: piezoelectric films; deposition methods; piezoelectric MEMS devices; piezoelectric energy harvesting

(This special issue belongs to the Section A：Physics)

Hydrodynamics of Micro Blood Vessels

edited by

S. Kokou Dadzie

submission deadline 31 Jul 2026 | Viewed by 7 | Submission Open

Keywords: micro/nano-fluidics; microvascular blood flow; micro/nanochannel flow; micro blood vessels; micro- and nano-channels; non-newtonian flow

(This special issue belongs to the Section B：Biology and Biomedicine)

Current and Emerging Microfabrication Techniques for Lab-on-a-Chip and Biomedical Microdevices: From Photolithography to 3D Printing

edited by

Qasem Ramadan

submission deadline 31 Jul 2026 | Viewed by 5 | Submission Open

Keywords: novel fabrication materials; fabrication techniques (molding; 3D printing; photolithography; nanofabrication; hot embossing; etc.); integration; sensor integration; three-dimensional microfluidics; hybrid devices; membrane-based microfluidic devices; paper-based microfluidic devices; fluid handling and automation

(This special issue belongs to the Section B：Biology and Biomedicine)

Micro- and Nano-Engineered Biomaterials and Devices for Regenerative Medicine and Therapeutics

edited by

Bin Kong

and Yu Song

submission deadline 31 Jul 2026 | Viewed by 2 | Submission Open

Keywords: biomaterials for regenerative medicine; hydrogels and microneedle devices; smart and responsive therapeutic materials; microfluidic and 3D-bioprinted constructs; bioinspired therapeutic devices

(This special issue belongs to the Section B2: Biofabrication and Tissue Engineering)

Advanced Magnetoelastic Immunosensors and Their Applications

edited by

Zhongyun Yuan

submission deadline 30 Aug 2026 | Viewed by 106 | Submission Open

Keywords: magnetoelastic sensors; magnetostrictive materials; magnetoelastic coupling; immunosensors; smart sensing

Smart Robots for Industrial Inspection: Integrating Micro-Technologies and Intelligent Systems

edited by

Bo Li

Min Li

and Xiaoling Li

submission deadline 30 Aug 2026 | Viewed by 95 | Submission Open

Keywords: soft robot; micro robots; industrial robot; control strategy; measurement and inspection; intelligent operation and maintenance; advanced sensors and micro-sensors integration

(This special issue belongs to the Section E：Engineering and Technology)

MEMS Gas Sensors and Electronic Nose

edited by Wenfeng Shen and Jun Yu

submission deadline 31 Aug 2026 | Viewed by 60 | Submission Open

Keywords: MEMS semiconductor gas sensors; MEMS optical gas sensors; electronic nose and its applications

(This special issue belongs to the Section B：Biology and Biomedicine)

Neuromorphic Memory and Computing-in-Memory Architectures: From Devices to Systems

edited by

Jinyong Wang

and Jing Liu

submission deadline 10 Sep 2026 | Viewed by 170 | Submission Open

Keywords: neuromorphic devices; memory devices; computing-in-memory; memristor; synaptic electronics; analog neural computing; crossbar arrays; von Neumann bottleneck; edge intelligence; optoelectronic memory; photonic– electronic hybrid computing; hardware AI accelerators; intelligent sensing

(This special issue belongs to the Section A：Physics)

Advanced Packaging for Microsystem Applications, 4th Edition

edited by

Wenchao Tian

and

Yongkun Wang

submission deadline 30 Sep 2026 | 1 articles | Viewed by 206 | Submission Open

Keywords: advanced packaging technology; MEMSs; reliability; NEMSs; packaging materials; modeling and simulation; design and manufacturing process; microsystems

(This special issue belongs to the Section A：Physics)

Fabrication, Reliability, Simulation, and Protection of Advanced Semiconductor Devices and Integrated Circuits: Enabled by Emerging Semiconductor Materials

edited by Xiyuan Feng and Yunlei Zhong

submission deadline 30 Sep 2026 | Viewed by 26 | Submission Open

Keywords: emerging semiconductor materials; advanced semiconductor devices; integrated circuits (ICs); fabrication processes; reliability engineering; multi-physics simulation; device protection strategies; wide-bandgap semiconductors (WBG); two-dimensional materials

(This special issue belongs to the Section D1: Semiconductor Devices)

Advances in Micro/Nano-Fabricated GaN-Based Semiconductor Devices: Materials, Processing, and Applications

edited by Lei Li

submission deadline 30 Sep 2026 | Viewed by 9 | Submission Open

Keywords: optoelectronic devices; electronic devices; material characterizations; device physics; device reliability

(This special issue belongs to the Section D1: Semiconductor Devices)

Advanced Functional Shape Memory Alloys and Their Applications

edited by

Girolamo Costanza

and

Maria Elisa Tata

submission deadline 31 Dec 2026 | Viewed by 7 | Submission Open

Keywords: shape memory alloys; superelasticity; martensitic transformation; thin films; microfabrication; smart actuators; elastocaloric effect; MEMS/NEMS; additive manufacturing

(This special issue belongs to the Section D：Materials and Processing)

Displaying special issue 351-400 on page 8 of 8.

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