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Materials, Structures and Manufacturing towards Soft Electronics

This special issue belongs to the section “E:Engineering and Technology“.

Special Issue Information

Dear Colleagues,

Soft electronics, such as wearable sensors, soft actuators, soft displays and flexible/stretchable energy devices, are quickly emerging and have demonstrated great potentials in a broad range of applications. Soft electronics, different from conventional rigid electronics, enable intimate integrations of electronics with dynamic nonplanar surfaces (e.g., human skin and robotic surfaces), and thus allow for enhanced robustness under deformations and improved device performance. Innovations in this highly multidisciplinary research area are driven by cross-disciplinary efforts in materials science, mechanical engineering, biomedical engineering, chemical engineering, and electrical engineering.

This Special Issue aims to showcase recent advances in this fast-growing field, ranging from strategies in material synthesis and structure design, to the development of advanced manufacturing techniques, and to the exploration of new applications. This Special Issue highlights research papers and review articles that cover different aspects related to soft electronics. Topics of interest include, but are not limited to:

  • Smart functional materials as building blocks for soft electronics;
  • Design, analysis, and modeling of smart structures for soft electronics;
  • Novel manufacturing techniques for soft electronics;
  • Experimental, theoretical, or modeling research towards the integration of soft electronics into advanced systems;
  • Hybrid systems integrating soft electronics and conventional electronics;
  • Emerging performance and applications of soft electronics, such as in healthcare, robotics, human–machine interaction, and entertainment.

Dr. Shanshan Yao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Smart Materials
  • Smart Structures
  • Advanced Manufacturing
  • Wearable Sensors
  • Flexible and Stretchable Electronics
  • Soft Electronics
  • Wearable Systems
  • Soft Actuators
  • Soft Robotics

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Micromachines - ISSN 2072-666X