Conferences

27–30 April 2015, Montpellier, France
2015 IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2015)

DTIP is a symposium including two main Conferences: the CAD, Design and Test Conference devoted to the development of Computer-Aided Design (CAD) tools and design methodologies for MEMS and MOEMS, and the Microfabrication, Integration and Packaging Conference dedicated to the development of integration technologies and packaging for MEMS and MOEMS. Both conferences share common plenary talks including invited talks, panels and special sessions to allow close interaction between both communities.

http://www.dtip-mems.org/

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