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Machines
Special Issues
Editorial Board Members’ Collection Series: Additive Manufacturing
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Editorial Board Members’ Collection Series: Additive Manufacturing

A special issue of Machines (ISSN 2075-1702). This special issue belongs to the section "Advanced Manufacturing".

Deadline for manuscript submissions: closed (30 November 2023) | Viewed by 2131

Special Issue Editors

Dr. Gianni Campatelli

E-Mail Website
Guest Editor
Department of Mechanical Engineering and Industrial Technologies, University of Firenze, Via Santa Marta, 3, 50139 Firenze, Italy
Interests: machining; machine dynamics; additive manufacturing; machine environmental impact; process optimization; machine control; optimization of tool path creation; machine simulation; machining process simulation; machine tool design; tooling analysis; process analysis and optimization
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Ibrahim Tansel

E-Mail Website
Guest Editor
Department of Mechanical Engineering, Florida International University, Miami, FL 33199, USA
Interests: additive manufacturing; structural health monitoring; signal processing; system identification; artificial intelligence applications
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce this Collection titled “Editorial Board Members’ Collection Series: Additive Manufacturing”, which will collect papers invited by the Editorial Board Members.

Additive manufacturing technologies are rapidly changing manufacturing industrial fields in terms of how products are designed and manufactured. They allow for the creation of complex designs with less material wastage when compared to parts that require machining, as well as allowing for the creation of lighter structures.

The aim of this Collection is to provide a venue for networking and communication between Machines and scholars in the field of additive manufacturing. All papers will be fully open access upon publication after peer review.

Dr. Gianni Campatelli
Prof. Dr. Ibrahim Tansel
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Machines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

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Research

15 pages, 7898 KiB  
Article
Enhancing Conversion Efficiency of Direct Ink Write Printed Copper (I) Sulfide Thermoelectrics via Sulfur Infusion Process
by Raden Gustinvil, William Jordan Wright, Giuseppe L. Di Benedetto, Donald Skelton, Samuel Stuart, John W. Drazin and Emrah Celik
Machines 2023, 11(9), 881; https://doi.org/10.3390/machines11090881 - 1 Sep 2023
Cited by 4 | Viewed by 1600
Abstract
Copper (I) sulfide (Cu2S) is a low-cost, earth-abundant, and non-toxic thermoelectric material for applications in the middle–high temperature range (>650 K). Although 3D printing these materials can simplify their manufacturing, elevated temperatures observed during sintering impair their crystal structure and energy [...] Read more.
Copper (I) sulfide (Cu2S) is a low-cost, earth-abundant, and non-toxic thermoelectric material for applications in the middle–high temperature range (>650 K). Although 3D printing these materials can simplify their manufacturing, elevated temperatures observed during sintering impair their crystal structure and energy conversion efficiency. In this study, we demonstrated a novel post-processing methodology to revert the thermoelectric properties of the 3D printed Cu2-xS materials back to the unimpaired state via sulfur infusion. After printing and sintering, sulfur was infused into the specimens under vacuum to optimize their crystal structure and achieve high thermoelectric efficiency. Chemical analysis and X-ray Diffraction (XRD) tests showed that after the sulfur infusion process, the Cu/S ratio was reverted close to the stoichiometric level. The 3D printed Cu2-xS showed p-type thermoelectric behavior with electrical conductivity peaking at 143 S-cm−1 at 750 K and Seebeck coefficient of 175 µV-K−1 at 627 K. The figure of merit (ZT) value of 1.0 at 780 K was achieved, which is the highest value ever reported for a 3D printed Cu2-xS thermoelectrics at this temperature. The fabrication of environmentally friendly thermoelectric materials with extended dimensional freedom and conversion efficiency has the potential to impact the thermoelectric industry with new energy conversion applications and lowered manufacturing costs. Full article
(This article belongs to the Special Issue Editorial Board Members’ Collection Series: Additive Manufacturing)
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