Semiconductor-Based Composites: Design, Fabrication, and Emerging Applications

A special issue of Journal of Composites Science (ISSN 2504-477X). This special issue belongs to the section "Composites Manufacturing and Processing".

Deadline for manuscript submissions: 31 October 2026 | Viewed by 78

Special Issue Editor


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Guest Editor
Faculty of Applied Sciences, Simon Fraser University, Surrey, BC V3T 0A3, Canada
Interests: nanofabrication; MEMS; semiconductor processing; material characterization; thin film deposition

Special Issue Information

Dear Colleagues,

In recent years, semiconductor-based composites have gained significant attention due to their synergistic properties that extend beyond those of individual components. This Special Issue, “Semiconductor-Based Composites: Design, Fabrication, and Emerging Applications”, aims to highlight advancements in the development, characterization, and integration of composite materials involving semiconductors. These materials play a critical role in modern technologies including flexible electronics, sensors, photovoltaics, and quantum devices.

The goal of this Special Issue is to publish contributions from researchers working on the design and processing of semiconductor-based composites, including hybrid nanostructures, thin-film heterostructures, and doped systems. Both experimental and theoretical studies are welcome, particularly those exploring novel functionalities, enhanced mechanical or electronic performance, and scalable fabrication techniques. We also welcome submissions addressing reliability, thermal stability, and device integration.

We invite original research articles, reviews, and short communications from scientists in academia, national labs, and industry to contribute to this Special Issue. We look forward to your contributions and hope this Special Issue serves as a platform for fruitful discussion and innovation in the field.

Dr. Azadeh Jafari
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Keywords

  • semiconductor composites
  • nanostructured materials
  • doped semiconductors
  • thin-film heterostructures
  • functional materials
  • MEMS/NEMS
  • photonic and quantum devices

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Published Papers

This special issue is now open for submission.
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